System Bits: Dec. 5

By Ann Mutschler - 05 Dec, 2017 - Comments: 0

[caption id="attachment_429586" align="aligncenter" width="300"] Vivienne Sze, an associate professor of electrical engineering and computer science at MIT. Source: MIT[/caption] Building deep learning hardware A new course at MIT is bringing together both electrical engineering and computer science to educate student in the highly sought after field of deep learning. Vivienne Sze, an assoc... » read more

Manufacturing Bits: Oct. 17

By Mark LaPedus - 17 Oct, 2017 - Comments: 0

WIMP dark matter detector The LUX-ZEPLIN (LZ) Group has taken another step towards finding an elusive part of the universe—dark matter. The LZ Group consists of 250 scientists and engineers from 37 institutions in the U.S., U.K., Portugal, Russia and Korea. In 2012, the group built the so-called Large Underground Xenon (LUX) dark matter detector. The detector is based on a 370 kilogram ... » read more

Manufacturing Bits: Aug. 29

By Mark LaPedus - 29 Aug, 2017 - Comments: 2

Compact synchrotron EUV sources For some time, the industry has been exploring the development of next-generation power sources for extreme ultraviolet (EUV) lithography. ASML and Gigaphoton are separately developing EUV sources based on the more traditional and compact laser-produced-plasma (LPP) technology. Then, in R&D, others are exploring the development of futuristic EUV sources us... » read more

Manufacturing Bits: April 25

By Mark LaPedus - 25 Apr, 2017 - Comments: 1

Making strange hadrons CERN, the European Organization for Nuclear Research, has produced and observed what it says are the world’s first sub-atomic particles called strange hadrons. Strange hadrons are well-known sub-atomic particles with names such as Kaon, Lambda, Xi and Omega, according to CERN. Strange hadrons have never been observed until now. The observation could shed light on su... » read more

Power/Performance Bits: Oct. 25

By Jesse Allen - 25 Oct, 2016 - Comments: 0

Energy-harvesting floor Engineers at the University of Wisconsin-Madison developed a flooring material which can be used as a triboelectric nanogenerator to convert footsteps into electricity. The method uses wood pulp, a common waste material already often used in flooring. The pulp is partly make of cellulose nanofibers, which when chemically treated produce an electrical charge when th... » read more

Joint R&D Has Its Ups And Downs

By Jeff Dorsch - 07 Sep, 2016 - Comments: 0

As corporate spending on research and development dwindles, enterprises are reaching out to colleges and universities to supplement their R&D. And they often are finding eager partners in those endeavors, as professors and their graduate students look for help, financial and technical, in addressing long-term research projects. “Pure research is just a luxury no one can afford anymore,... » read more

Power/Performance Bits: Aug. 9

By Jesse Allen - 09 Aug, 2016 - Comments: 0

Phase-change memory Researchers at Stanford are working on phase-change memory technology, which could deliver the best of volatile and non-volatile memory. Phase-change materials can exist in two different atomic structures, each of which has a different electronic state. A crystalline, or ordered, atomic structure, permits the flow of electrons, while an amorphous, or disordered, struct... » read more

Power/Performance Bits: June 28

By Jesse Allen - 28 Jun, 2016 - Comments: 0

Mimicking roses for solar Scientists from the Karlsruhe Institute of Technology (KIT) and the Center for Solar Energy and Hydrogen Research Baden-Württemberg (ZSW) reproduced the epidermal cells of rose petals and integrated the transparent replicas into an organic solar cell, with an efficiency gain of 12%. The epidermis of rose petals consists of a disorganized arrangement of densely p... » read more

Manufacturing Bits: June 7

By Mark LaPedus - 07 Jun, 2016 - Comments: 0

Intel’s spintronic spectrometer Intel and Stanford University have presented the first results for a technology called a ferromagnetic resonance (FMR) spectrometer. Initially invented and developed by the National Institute of Standards and Technology (NIST), FMR examines the properties of materials for spintronic-based memories. Today’s DRAMs store binary data in tiny capacitors. I... » read more

Manufacturing Bits: May 17

By Mark LaPedus - 17 May, 2016 - Comments: 0

Isolating diamondoids Stanford and the SLAC National Accelerator Laboratory are finding new ways to isolate diamondoids. Diamondoids, which are tiny specks of diamond, are found in petroleum fluids. The smallest diamondoid consists of 10 atoms. A diamondoid weighs less than a billionth of a billionth of a carat. A carat is a unit of mass equal to 200 mg. [caption id="attachment_27544" ... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?