Stressing Over 3D

By Ed Sperling - 24 Jun, 2010 - Comments: 0

By David Lammers Pol Marchal recalls putting a stacked 3D prototype on his desk at IMEC in Leuven, Belgium, last year, which a visitor picked up and examined two months later. “I don’t think this chip will work,” the visitor said, causing Marchal, principal scientist at IMEC’s 3D system integration program, to put the stacked die under a microscope. Sure enough, Pol found that mechanic... » read more

Field Solvers To The Rescue

By Ed Sperling - 25 Mar, 2010 - Comments: 0

By Pallab Chatterjee Field solvers have always been part of the Parasitic Extraction (PEX) world, but due to their long run times and complexity in configuration, their role was relegated to the setup/reference table generation for the pattern based 1-D and 2-D RC extraction tools. That’s about to change. Mentor, in combination with STMicroelectronics, one of it customers, said that at ... » read more

Journey To The Center Of The Ecosystem

By Ed Sperling - 14 Jan, 2010 - Comments: 0

From the outside it looks like business as usual, but the race for board seats on the GSA has become particularly competitive this year. GSA originally was created as an organization for fabless companies, but you wouldn’t know that looking at its membership roster. It has evolved into a who’s who of the entire semiconductor supply chain, including everyone from foundries like TSMC and... » read more

The Ins And Outs Of Power Conversion

By Ed Sperling - 10 Dec, 2009 - Comments: 0

By Cheryl Ajluni Power conversion is a general term that refers to a system or device producing an output that is different than its input. It can assume many forms—everything from an inverter to an isolated power supply, uninterruptable power supply (UPS), or AC/DC converter. Power conversion, like low-power design, is fairly commonplace these days. Nevertheless, recent advances in digital ... » read more

3D Integration: Extending Moore’s Law Into The Next Decade

By Cheryl Ajluni - 27 Aug, 2009 - Comments: 0

By Cheryl Ajluni At the 46th Design Automation Conference in San Francisco last month, attention turned to a discussion of how to extend the momentum of Moore’s Law into the next decade. One plausible solution, according to Philippe Magarshack, the general manager of Central CAD & Design Solutions at STMicroelectronics, is 3D stacking for complex System-on-Chips (SoCs). The concept of 3... » read more

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Knowledge Centers
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