Industry Pushes For Fab Tool Security Standards

By Mark LaPedus - 17 Sep, 2020 - Comments: 1

The semiconductor industry is developing new cybersecurity standards for fab equipment in an effort to protect systems from potential cyberattacks, viruses, and IP theft. Two new standards are in the works, which are being formulated under the auspices of the SEMI trade group with leadership from chipmakers and others. Led by Intel and Cimetrix, the first standard deals with malware-free equ... » read more

Better Security, Lower Cost

By Ed Sperling - 10 Aug, 2020 - Comments: 0

For years, chipmakers have marginalized security in chips, relying instead on software solutions. Eventually that approach caught up with them, creating near panic in a scramble to plug weaknesses involving speculative execution and branch prediction, as well as the ability to read the data from chips with commercially available tools such as optical probes. There were several reasons for th... » read more

New Approaches For Hardware Security

By Ed Sperling - 01 Aug, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss a wide range of hardware security issues and possible solutions with Norman Chang, chief technologist for the Semiconductor Business Unit at ANSYS; Helena Handschuh, fellow at Rambus, and Mike Borza, principal security technologist at Synopsys. What follows are excerpts of that conversation. (L-R) Norman Chang, Helena Handschuh, Mike Borza. Pho... » read more

IoT Security Risks Grow

By Ed Sperling - 05 Dec, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss security issues with Asaf Shen, vice president of marketing for security IP in [getentity id="22186" comment="ARM"]'s Systems & Software Group; Timothy Dry, principal staff marketing manager for the Industrial IoT segment at GlobalFoundries; Chowdary Yanamadala, senior vice president of business development at [getentity id="22819" comment="Glob... » read more

The Price Of Fear

By Ed Sperling - 03 Mar, 2016 - Comments: 0

Fear sells, and judging from the attendance numbers and the messages coming out of this week's RSA Conference, it's selling quite well. Increasing connectedness comes at a significant price, and apparently lots of people are willing to pay that price. Security has become a huge and growing business. Attendance is one indicator. There were an estimated 40,000 attendees at this year's conferen... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Stuxnet

Industry Pushes For Fab Tool Security Standards

Better Security, Lower Cost

New Approaches For Hardware Security

IoT Security Risks Grow

The Price Of Fear

Trending Articles

Hybrid Bonding Makes Strides Toward Manufacturability

Americas Chip Funding Energizes Industry

Advanced Packaging Driving New Collaboration Across Supply Chain

Startup Funding: Q3 2024

Chiplets Make Progress Using Interconnects As Glue

Knowledge Centers
Entities, people and technologies explored