tag: SUNY

Direct-To-Chip Liquid-Cooled Data Centers (Binghamton, Nvidia)
By Technical Paper Link - 22 Nov, 2024 - Comments: 0

A new technical paper titled "Parameters of performance: A deep dive into liquid-to-air CDU assessment" was published by researchers at Binghamton University-SUNY and NVIDIA. Abstract: "The rapid growth in data center workloads and the increasing complexity of modern applications have led to significant contradictions between computational performance and thermal management. Traditional air... » read more

Multi-Layer Attack Graph Analysis in the 5G Edge Network Using a Dynamic Hexagonal Fuzzy Method
By Technical Paper Link - 10 Jan, 2022 - Comments: 0

Abstract "Overall, 5G networks are expected to become the backbone of many critical IT applications. With 5G, new tech advancements and innovation are expected; 5G currently operates on software-defined networking. This enables 5G to implement network slicing to meet the unique requirements of every application. As a result, 5G is more flexible and scalable than 4G LTE and previous generations... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 15 Feb, 2019 - Comments: 0

Chipmakers and OEMs South Korean chipmaker MagnaChip reported its results. It has also undertaken a strategic evaluation of the company's foundry business and Fab 4, the larger of the company's two 200mm fabs. “The strategic evaluation is expected to include a range of possible options, including, but not limited to, joint ventures, strategic partnerships as well as M&A possibilities. The co... » read more

Integrated Photonics (Part 2)
By Brian Bailey - 06 Sep, 2017 - Comments: 1

Semiconductor Engineering sat down to discuss the status of integrated photonics with Twan Korthorst, CEO for PhoeniX Software; Gilles Lamant, distinguished engineer for [getentity id="22032" e_name="Cadence"]; Bill De Vries, director of marketing for Lumerical Solutions; and Brett Attaway, director of EPDA solutions at AIM Photonics, SUNY Polytechnic Institute. What follows are excerpts of tha... » read more

Integrated Photonics (Part 1)
By Brian Bailey - 30 Aug, 2017 - Comments: 0

Semiconductor Engineering sat down to discuss the status of integrated photonics with Twan Korthorst, CEO for PhoeniX Software; Gilles Lamant, distinguished engineer for [getentity id="22032" e_name="Cadence"]; Bill De Vries, director of marketing for Lumerical Solutions; and Brett Attaway, director of EPDA solutions at AIM Photonics, SUNY Polytechnic Institute. What follows are excerpts of tha... » read more

The Other Side Of H1-B Visas
By Katherine Derbyshire - 20 Apr, 2017 - Comments: 0

There is a lot of discussion these days about “Hire American.” But what does that actually mean in practice? I’m at the Materials Research Society Spring Meeting this week, where one of the presentations was by a scientist who works at the TEL Technology Center, America, in Albany, NY. It’s the largest Tokyo Electron research center outside of Japan. It’s affiliated with the SUNY P... » read more

Manufacturing Bits: July 28
By Mark LaPedus - 28 Jul, 2015 - Comments: 0

Molecular chips Researchers from various organizations have devised a transistor consisting of a single molecule and a few atoms. The work could one day lead to the integration of molecular-based devices with existing semiconductor technologies. This work was conducted by Paul-Drude-Institut für Festkörperelektronik (PDI), Freie Universität Berlin (FUB), NTT and the U.S. Naval Research L... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 06 Feb, 2015 - Comments: 0

IBM continues to cut jobs, according to IEEE Spectrum and an IBM employee organization. Meanwhile, IBM and SUNY Polytechnic Institute announced that more than 220 engineers and scientists who lead IBM's advanced chip R&D efforts at SUNY Poly's Albany Nanotech campus will become part of IBM Research. While military applications continue to experience strong growth in RF gallium-nitride (GaN)... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 13 Jun, 2014 - Comments: 0

In a much-anticipated deal, IBM is close to selling its chip unit to GlobalFoundries, according to Bloomberg. GlobalFoundries wants IBM’s engineers and the IP, and not the fabs. Intel lost its challenge against a record 1.06 billion euro ($1.44 billion) European Union fine handed down five years ago, according to Reuters. The EU said Intel tried to thwart AMD by giving rebates to PC makers... » read more

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