200mm Shortages May Persist For Years

By Mark LaPedus - 20 Jan, 2022 - Comments: 2

A surge in demand for chips at more mature process nodes is causing shortages for both 200mm foundry capacity and 200mm equipment, and it shows no signs of letting up. In fact, even with new capacity coming on line this year, shortages are likely to persist for years, driving up prices and forcing significant changes across the semiconductor supply chain. Shortages for both 200mm foundry cap... » read more

Blog Review: May 19

By Jesse Allen - 19 May, 2021 - Comments: 0

Cadence's Paul McLellan checks out a project from Intel and DARPA to combine the eASIC structured ASIC technology with data interface chiplets and enhanced security protection, with manufacturing in the U.S. In a podcast, Siemens EDA's Ellie Burns and Michael Fingeroff discuss the gap between what the best AI applications can perform today versus the human brain and the challenges that hardw... » read more

Long Lead Times Seen For Equipment

By Mark LaPedus - 18 Mar, 2021 - Comments: 1

There are a number of big stories in the semiconductor market thus far in 2021. Automotive chip shortages and tight foundry capacity are among the bigger ones. That’s just for starters. What hasn’t received much attention is the ongoing shortages and long lead times for semiconductor equipment. In some cases, lead times have stretched out to 12 months or more for some equipment. Some t... » read more

200mm Demand Surges

By Mark LaPedus - 17 Dec, 2020 - Comments: 1

A surge in demand for various chips is causing shortages for select 200mm foundry capacity as well as 200mm fab equipment, and it shows no signs of abating in 2021. Foundry customers will face a shortfall of 200mm capacity at select foundries at least in the first half of 2021, and perhaps beyond. Those customers will need to plan ahead to ensure they obtain enough 200mm capacity in 2021. Ot... » read more

Demand Picks Up For 200mm

By Mark LaPedus - 20 Feb, 2020 - Comments: 0

Demand is growing for both 200mm fab capacity and equipment, setting the stage for possible shortages in coming months. But there are also some uncertainties, if not warning signs, in the 200mm market and the entire IC industry. Trade disputes, as well as the current coronavirus outbreak in China, likely will impact the chip and equipment markets. The size of the impact and the duration rema... » read more

200mm Cools Off, But Not For Long

By Mark LaPedus - 18 Jul, 2019 - Comments: 4

After years of acute shortages, 200mm fab capacity is finally loosening up, but the supply/demand picture could soon change with several challenges on the horizon. 200mm fabs are older facilities with more mature processes, although they still churn out a multitude of today’s critical chips, such as analog, MEMS, RF and others. From 2016 to 2018, booming demand for these and other chips ca... » read more

Fab Equipment Challenges For 2019

By Mark LaPedus - 17 Dec, 2018 - Comments: 0

After a period of record growth, the semiconductor equipment industry is facing a slowdown in 2019, in addition to several technical challenges that still need to be resolved. Generally, the equipment industry saw enormous demand in 2017, and the momentum extended into the first part of 2018. But then the memory market began deteriorating in the middle of this year, causing both DRAM and NAND ... » read more

Mixed Outlook For Semi Biz

By Mark LaPedus - 25 Jul, 2018 - Comments: 0

Both the IC and fab equipment industries have been enjoying a boom cycle for some time, but they could be facing speed bumps and possibly turbulence in the second half of this year and into 2019. In the first half of 2018, the industry was fueled by the momentum carried over from 2017. DRAM prices remained relatively high, which contributed to the revenue growth in the overall IC industry. M... » read more

200mm Fab Crunch

By Mark LaPedus - 21 May, 2018 - Comments: 2

Growing demand for analog, MEMS and RF chips continues to cause acute shortages for both 200mm fab capacity and equipment, and it shows no sign of letting up. Today, 200mm fab capacity is tight with a similar situation projected for the second half of 2018 and perhaps well into 2019. In fact, 2018 will likely represent the third consecutive year that 200mm fab capacity will be tight. The sam... » read more

Will Fab Tool Boom Cycle Last?

By Mark LaPedus - 18 Dec, 2017 - Comments: 2

Fab equipment spending is on pace for a record year in 2017, and it now appears that momentum could continue into 2018. Fab tool vendors found themselves in the midst of an unexpected boom cycle in 2017, thanks to enormous demand for equipment in [getkc id="208" comment="3D NAND"] and, to a lesser degree, [getkc id="93" kc_name="DRAM"]. In the logic/foundry business, however, equipment deman... » read more

← Older posts

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?