Why Banks Should Be More Worried About Security

By John Koon - 03 Mar, 2022 - Comments: 1

At about 10:30 a.m. on Friday, Feb. 5, 2016, Jubail Bin-Huda, a joint director of Bangladesh Bank, and a colleague went to pick up the latest Society for Worldwide Interbank Financial Telecommunication (SWIFT) acknowledgement messages from the printer. When they got to the printer, they found nothing had been printed. They restarted the printer manually, but it still didn't work. They had no... » read more

Data Center Architectures In Flux

By Ann Mutschler - 24 Feb, 2022 - Comments: 0

Data center architectures are becoming increasingly customized and heterogeneous, shifting from processors made by a single vendor to a mix of processors and accelerators made by multiple vendors — including system companies' own design teams. Hyperscaler data centers have been migrating toward increasingly heterogeneous architectures for the past half decade or so, spurred by the rising c... » read more

Inside Advanced Packaging

By Mark LaPedus - 18 Feb, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss advanced IC-packaging, the OSAT industry, China and other topics with Ron Huemoeller, vice president of worldwide R&D at Amkor. What follows are excerpts of that conversation. SE: Where are we in advanced IC-packaging today? Huemoeller: We’ve hit the inflection point. Now we are coming to the other side of it. Regarding this need to int... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Swift

Why Banks Should Be More Worried About Security

Data Center Architectures In Flux

Inside Advanced Packaging