AI For The Edge: Why Open-Weight Models Matter


The rapid advancements in AI have brought powerful large language models (LLMs) to the forefront. However, most high-performing models are massive, compute-heavy, and require cloud-based inference, making them impractical for edge computing. The recent release of DeepSeek-R1 is an early, but unlikely to be the only, example of how open-weight AI models, combined with efficient distillation t... » read more

Auto Sector Leads The Way In IC Security


Concerns about chip and system security are beginning to bear fruit in some markets, driven by the overlap in safety and security in automotive applications and the growing value of algorithms and complex systems in others. But how and when that security is implemented is still all over the map, and so is its effectiveness. The reasons are as nuanced as the designs themselves, which makes it... » read more

Chip Industry Week In Review


ASML and imec signed a five-year strategic partnership to advance semiconductor innovation and sustainable technology. The collaboration will leverage ASML’s full product portfolio, including high-NA EUV, DUV immersion, and advanced metrology tools, within imec’s pilot line for sub-2nm R&D. Supported by EU and national funding, it will also drive research in silicon photonics, memory, a... » read more

Chip Industry Week In Review


The Malaysian government signed a deal with Arm to kickstart a chip design ecosystem. Until now, Malaysia has focused on packaging and test. Adding chip design represents a major change in focus. The country will pay SoftBank $250 million over 10 years for Arm’s chip design IP and train 10,000 engineers. Global chip sales reached $56 billion in January, up nearly 18% from the same period i... » read more

Three Key Reasons That The Future Of Smart Home Devices Is Embedded Contextual AI


Artificial intelligence has become a transformative force, reshaping how consumers interact with technology. Consumer-level AI tools like ChatGPT have set new benchmarks for smart home devices, raising expectations for seamless functionality, natural language interactions, and personalized user experiences. As consumers demand smarter, more intuitive devices, embedded engineers and system engin... » read more

Wearable Connectivity, AI Enable New Use Cases


The sensing and processing technology used in smart phones, watches, and rings is starting to be being deployed in a wide variety of wearable devices, ranging from those that fill the gap between sports and med tech, to haptic devices to assist the visually impaired and AR/VR glasses. Emerging applications include payment, building, and factory wearables. Most of these devices process signal... » read more

Chip Industry Week In Review


The chip industry is well on its way to hit $1 trillion in revenue by the end of its decade. Several analyst firms released 2024 annual results and 2025 predictions: Worldwide semiconductor revenue reached $626 billion in 2024, an 18% increase versus 2023, according to preliminary Gartner report. Memory revenue grew about 70%  2024 versus 2023. The firm forecasts that HBM will make up 19%... » read more

Med Tech Morphs Into Consumer Wearables


Doctors have been using advanced technology for years, but the growing trend is for consumers to use devices at home and have direct access to their data. Watches and rings that were once primarily used for counting steps or registering sleep patterns can now read blood pressure, heart rate, blood oxygen, body temperature, and other early signs of illness. Meanwhile, various patches are under d... » read more

Chip Industry Week In Review


Chinese startup DeepSeek rattled the tech world and U.S. stock market with claims it spent just $5.6 million on compute power for its AI model compared to its billion-dollar rivals in the U.S. The announcement raised questions about U.S. investment strategies in AI infrastructure and led to an initial $600 billion selloff of NVIDIA stock. Since its launch, DeepSeek reportedly was hit by malicio... » read more

Global IC Fabs And Facilities Report: 2024


The chip industry made significant capital investments this year to build new fabs and facilities or expand existing premises. A number of sites were dedicated to SiC, GaN, DRAM, HBM, along with packaging and assembly by OSATs, and essential gases, chemicals, and other components. More than a dozen R&D centers were also established for 8-inch wafers, EUV, and advanced packaging. Investments... » read more

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