tag: system-level test

Test Anything, Anywhere, Anytime
By Peter Orlando - 09 Jun, 2026 - Comments: 0

The semiconductor industry is under relentless pressure to deliver devices that are not only high-performing but also exceptionally reliable across their entire lifecycle. From the moment a chip is tested at the wafer to its deployment in complex systems such as data centers and automotive platforms, the expectation is clear: zero-defect quality at shipment and continuous reliability in the fie... » read more

Test Distribution Evolves To Meet AI Challenges
By Fabio Pizza - 12 May, 2026 - Comments: 0

The proliferation of artificial intelligence (AI) is driving rapid acceleration of the semiconductor market, which analysts now predict will reach $1 trillion this year. Many semiconductor devices will be the GPUs that populate the data centers that run AI workloads. Driven by strong, sustained investments from hyperscaler operators, high-performance computing (HPC)/AI data centers are expected... » read more

Are You Using Structural Patterns In An SLT Environment?
By Peter Orlando - 10 Feb, 2026 - Comments: 0

Extending the in‑field life of your silicon is essential for long‑term success and for staying ahead of your competitors in today’s rapidly evolving digital world of data centers, automotive and cellular chipsets, and AI applications. For those reasons, it’s increasingly important to test your silicon in a System Level Test (SLT) environment. Testing in an SLT environment offers many be... » read more

Tackling Chip Complexity With Integrated System-Level Test Solutions
By Davette Berry - 09 Dec, 2025 - Comments: 0

As the sophistication of semiconductors continues to grow, so does the need for system-level test (SLT) in production to ensure that high-performance processors, chiplets, and other advanced devices function as expected in real-world environments. Once seen primarily as a fallback to catch what traditional automated test equipment (ATE) missed, SLT has now become a mission-critical step for val... » read more

Chiplet Integration and Testing: Key Lessons for Next-Gen Semiconductor Packaging
By Vineet Pancholi - 20 Nov, 2025 - Comments: 0

The Chiplet Era Has Arrived The floodgates for chiplet-based design have officially opened. Over the past several quarters, manufacturing test flows have been validating 2.5D package architectures, and production volumes are ramping up. These designs promise flexibility and performance, but they also introduce new test sensitivities—electrical, thermal, and mechanical—that challenge tradit... » read more

Case Study: Production Yield And Throughput Improvement Using The Known Good Socket Analysis
By Jesse Ko - 09 Sep, 2025 - Comments: 0

The test sockets, which are crucial components that directly interface with semiconductor IC packages, have a profound impact on device testing performance. Pins with high CRES not only cause false failures in the test but also lower bin grading results, which in turn increase the manufacturing cost due to reduced production performance. The ever-increasing demand driven by high-performance com... » read more

Overview of Incorporating LLMs into EDA, With 3 Case Studies (TU Munich et al.)
By Technical Paper Link - 05 Sep, 2025 - Comments: 0

A new technical paper titled "Large Language Models (LLMs) for Electronic Design Automation (EDA)" was published by researchers at the Technical University of Munich, University of Stuttgart, New York University, and University of Siegen. Abstract "With the growing complexity of modern integrated circuits, hardware engineers are required to devote more effort to the full design-to-manufactu... » read more

Rethinking Chip Reliability For Harsh Conditions
By Gregory Haley - 10 Jun, 2025 - Comments: 0

As semiconductors push into environments once considered untenable, reliability expectations are being redefined. From the vacuum of space and the inside of jet engines to deep industrial automation and electrified drivetrains, chips now must endure extreme temperature swings, corrosive atmospheres, mechanical vibration, radiation, and unpredictable power cycles, all while delivering increasing... » read more

Semiconductor Test Faces Technology Shifts In The AI Era
By Jeorge Hurtarte - 10 Dec, 2024 - Comments: 1

The surge in data-rich applications shows no signs of slowing down, fueling significant evolution within the global semiconductor industry. This insatiable demand for data necessitates a comprehensive ecosystem involving sensors and systems to capture data, networks to transmit it, and storage and processing power to analyze it. Successful deployment of these applications relies on the devel... » read more

Advanced Packaging Drives Test And Metrology Innovations
By Gregory Haley - 12 Nov, 2024 - Comments: 1

Advanced packaging has become a focal point for innovation as the semiconductor industry continues to push for increased transistor density and better performance. But the pace of change is accelerating, making it harder for the entire ecosystem to keep up with those changes. In the past, major developments were roughly on an 18-month to 2-year cadence. Today, this is happening every few mon... » read more

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