System-Level Test: Where Does It Fit?


Our second C-Brief discusses where system-level test (SLT) best fits into your semiconductor test workflow. With automated testing equipment (ATE), a traditional workflow may consist of: Wafer sort (WS) Burn-in after packaging (BI) Combination of structural testing (ST) and functional testing (FT). As demands on high-volume manufacturing shift in response to wider industry and com... » read more

The Race To Zero Defects


By Jeff Dorsch and Ed Sperling Testing chips is becoming more difficult, more time-consuming, and much more critical—particularly as these chips end up in cars, industrial automation, and a variety of edge devices. Now the question is how to provide enough test coverage to ensure that chips will work as expected without slowing down the manufacturing process or driving up costs. Balanci... » read more

The Financial Justification For System-Level Test


Three unique trends are currently transforming high-volume manufacturing in the semiconductor industry: The increasing complexity of chip architectures (e.g., FinFET, heterogeneous integration); The explosion in the breadth and ubiquity of consumer electronics (e.g. IoT, mobile, and automotive), and Consumer expectations of a constant stream of newer, cheaper, more advanced nodes. ... » read more

Looking At Test Differently


Wilhelm Radermacher, executive advisor at [getentity id="22816" e_name="Advantest"], sat down with Semiconductor Engineering to discuss how the impact of rapid market changes, advanced packaging approaches and increasing complexity on test strategies and equipment. What follows are excerpts of that conversation. SE: As we move into new markets where use models and stresses on devices are dif... » read more

What’s In The Package?


Putting a variety of chips or hardened IP blocks into a package rather than trying to cram them into a single chip continues to gain ground. But it's also creating its own set of issues around verifying and testing these devices. This problem is well understood inside of SoCs, where everything is integrated into a single die. And looked at from a 30,000-foot perspective, packaging is someth... » read more

Auto Chip Test Issues Grow


By Jeff Dorsch & Ed Sperling Semiconductor suppliers are flocking to the automotive chip market to gain share in fitting out the connected car and the autonomous vehicle. But before those chips are sold to automotive manufacturers and Tier 1 suppliers, they must be tested and certified to meet stringent industry standards. This is no ordinary testing, though. Assisted and autonomous v... » read more

Getting Serious About Chiplets


Demand for increasingly complex computation, more features, lower power, and shorter lifecycles are prompting chipmakers to examine how standardized hard IP can be used to quickly assemble systems for specific applications. The idea of using chiplets, with or without a package, has been circulating for at least a half-dozen years, and they can trace their origin back to IBM's packaging schem... » read more

Changes Ahead For Test


Testing microprocessors is becoming more difficult and more time consuming as these devices are designed to take on more complex tasks, such as accelerating artificial intelligence computing, enabling automated driving, and supporting deep neural networks. This is not just limited to microprocessors, either. Graphics processing units are grabbing market share in supercomputing and other area... » read more

That Was The Year That Was In Test


Looking back on the year about to end, one deal stands out, because it is in legal limbo – the proposed $580 million acquisition of Xcerra by Hubei Xinyan Equity Investment Partnership. At this writing, the transaction has not been completed. Both parties said they planned to sew up the purchase by the end of 2017, so a few weeks remain to make that happen. The deal is in the hands of t... » read more

2017 ITC Wrap-up


Advantest was among the exhibitors and corporate sponsors at last week’s 2017 International Test Conference in Fort Worth, Texas. The automatic test equipment company also presented papers, took part in sessions, and provided posters during ITC’s technical program. In the booth, Advantest demonstrated its on-demand CloudTesting Service. It also showed off its EVA100 analog/mixed-signal IC t... » read more

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