Module Testing Adds New Challenges


System-in-package (SiP) and other advanced packaging technologies are putting more components together in tighter spaces than previously seen. Often these packages are contained in a module, which is something more than a chip package and a great deal smaller than most printed circuit boards. Testing these modules often requires system-level test. These modules typically will be inserted int... » read more

Massively Parallel System-Level Testing


Decades of advances in the semiconductor industry continue to drive an insatiable consumer demand for smaller, more powerful, more ubiquitous devices – whether in our cars, on our countertops or around our wrists. To meet this demand now and into the future, the fabrication of increasingly complex semiconductor systems for an incredible spectrum of applications must scale accordingly. Additio... » read more

The Future of Testing


In our previous test blog posts, we looked at the history of automated test equipment for semiconductors and for printed circuit boards. This month, we look ahead to the test technologies that are emerging. The chip ATE field has essentially boiled down to Advantest, Teradyne, and Xcerra (LTX-Credence), while the board test market is dominated by Teradyne and Keysight Technologies (formerly ... » read more