tag: TEL

Week In Review: Manufacturing, Test
By Mark LaPedus - 27 Jul, 2018 - Comments: 0

Trade issues China and the United States are embroiled in a trade war. What is the impact? In testimony submitted to the Office of the United States Trade Representative (USTR) on the proposed tariffs on Chinese products, Consumer Technology Association (CTA) Vice President of International Trade Sage Chandler argues tariffs negatively impact businesses and consumers as well as fail to corr... » read more

Mixed Outlook For Semi Biz
By Mark LaPedus - 25 Jul, 2018 - Comments: 0

Both the IC and fab equipment industries have been enjoying a boom cycle for some time, but they could be facing speed bumps and possibly turbulence in the second half of this year and into 2019. In the first half of 2018, the industry was fueled by the momentum carried over from 2017. DRAM prices remained relatively high, which contributed to the revenue growth in the overall IC industry. M... » read more

Where Is Selective Deposition?
By Mark LaPedus - 25 Jun, 2018 - Comments: 4

For years, the industry has been working on an advanced technology called area-selective deposition for chip production at 5nm and beyond. Area-selective deposition, an advanced self-aligned patterning technique, is still in R&D amid a slew of challenges with the technology. But the more advanced forms of technology are beginning to make some progress, possibly inching closer from the la... » read more

Dealing With Resistance In Chips
By Mark LaPedus - 21 Jun, 2018 - Comments: 2

Chipmakers continue to scale the transistor at advanced nodes, but they are struggling to maintain the same pace with the other two critical parts of the device—the contacts and interconnects. That’s beginning to change, however. In fact, at 10nm/7nm, chipmakers are introducing new topologies and materials such as cobalt, which promises to boost the performance and reduce unwanted resist... » read more

Big Trouble At 3nm
By Mark LaPedus - 21 Jun, 2018 - Comments: 0

As chipmakers begin to ramp up 10nm/7nm technologies in the market, vendors are also gearing up for the development of a next-generation transistor type at 3nm. Some have announced specific plans at 3nm, but the transition to this node is expected to be a long and bumpy one, filled with a slew of technical and cost challenges. For example, the design cost for a 3nm chip could exceed an eye-p... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 15 Jun, 2018 - Comments: 0

Chipmakers and OEMs Tesla Motors has been struggling to get its new electric car, the Model 3, out the door. And it recently implemented a layoff amid ongoing losses. But the struggling car maker could be in the midst of a rebound. “Based on our checks, we believe the perceived quality of Model 3s coming off the lines continue to improve relative to prior checks, and we view this as one of t... » read more

The Week In Review: Manufacturing
By Ed Sperling - 01 Jun, 2018 - Comments: 0

Cleanliness is a good thing. In the fab, it's also a very profitable thing. According to a report from Research and Markets, the wafer cleaning systems market will grow more than 6%. The research house notes, however, that the rate of growth is slowing. GlobalFoundries began volume production of its 180nm ultra-high-voltage process for industrial and power applications. The base platform sta... » read more

200mm Fab Crunch
By Mark LaPedus - 21 May, 2018 - Comments: 2

Growing demand for analog, MEMS and RF chips continues to cause acute shortages for both 200mm fab capacity and equipment, and it shows no sign of letting up. Today, 200mm fab capacity is tight with a similar situation projected for the second half of 2018 and perhaps well into 2019. In fact, 2018 will likely represent the third consecutive year that 200mm fab capacity will be tight. The sam... » read more

FinFET Metrology Challenges Grow
By Mark LaPedus - 17 May, 2018 - Comments: 1

Chipmakers face a multitude of challenges in the fab at 10nm/7nm and beyond, but one technology that is typically under the radar is becoming especially difficult—metrology. Metrology, the art of measuring and characterizing structures, is used to pinpoint problems in devices and processes. It helps to ensure yields in both the lab and fab. At 28nm and above, metrology is a straightforward... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 27 Apr, 2018 - Comments: 0

Chipmakers As reported, Intel is struggling at 10nm. Intel already has encountered some difficulties, as the chip giant late last year pushed out the volume ramp of its new 10nm process from the second half of 2017 to the first part of 2018, according to analysts. Intel continues to struggle with 10nm, and has delayed the volume ramp again, according to multiple reports. During its earnings... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy