tag: TEL

Week In Review: Manufacturing, Test
By Karen Heyman - 16 Sep, 2022 - Comments: 0

President Biden signed an executive order on Sept. 15, limiting foreign investments in U.S. technology by "competitor or adversarial nations" that are deemed a threat to national security. In the past, the Committee on Foreign Investment in the United States (CFIUS) largely limited its actions to the sale of U.S. companies. The new directive expands that to include investments involving "U.S. s... » read more

Smart Manufacturing And Advanced Technical Service
By Serena Brischetto - 15 Sep, 2022 - Comments: 0

SEMI spoke with Eyal Shekel, senior vice president of Service Strategy and Excellence at Tokyo Electron Limited, about the impact of artificial intelligence (AI) on smart manufacturing and how other fab solutions for smarter process tools are advancing semiconductor manufacturing. SEMI: AI technology is considered a key enabler for smart manufacturing. What are the latest trends? Shekel:... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 09 Sep, 2022 - Comments: 0

Some funding details are now available for the CHIPS Act in the U.S. The Biden Administration plans to spend the money in the following ways: $28 billion to establish domestic production of leading-edge logic and memory chips through grants, subsidized loans or loan guarantees; $10 billion to increase production of current-generation semiconductors and chips, and $11 billion for rese... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 12 Aug, 2022 - Comments: 0

Government funding President Biden signed the CHIPS and Science Act into law on Tuesday, saying “America is back and leading the way.” That same day Micron touted a $40 billion investment through to 2030, which it expects will create 40,000 American jobs. “This legislation will enable Micron to grow domestic production of memory from less than 2% to up to 10% of the global market in t... » read more

Hybrid Bonding Moves Into The Fast Lane
By Laura Peters - 21 Jul, 2022 - Comments: 1

The industry’s unquenchable thirst for I/O density and faster connections between chips, particularly logic and cache memory, is transforming system designs to include 3D architectures, and hybrid bonding has become an essential component in that equation. Hybrid bonding involves die-to-wafer or wafer-to-wafer connection of copper pads that carry power and signals and the surrounding diele... » read more

Week In Review, Manufacturing, Test
By Susan Rambo - 08 Jul, 2022 - Comments: 0

The U.S. is attempting to restrict sales of ASML’s deep ultra-violet (DUV) litho systems to China, according to a report from Bloomberg. The U.S. has been working to limit China's access to advanced technology for some time, and it has already limited sales of extreme ultra-violet (EUV), which is used to develop chips at the most advanced process nodes. DUV, in contrast, is used for older-nod... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 24 Jun, 2022 - Comments: 0

Notes from the fabs Intel warned the “scope and pace" of the Ohio fab buildout could be impacted due to U.S. Congress’ inaction on funding the $52 billion CHIPS Act. The facility was announced in January with an initial phase investment of more than $20 billion with a larger expansion up to $100 billion over the next decade. The initial phase is not expected to be impacted, other than a de... » read more

High-NA EUV May Be Closer Than It Appears
By Katherine Derbyshire - 16 Jun, 2022 - Comments: 1

High-NA EUV is on track to enable scaling down to the Angstrom level, setting the stage for chips with even higher transistor counts and a whole new wave of tools, materials, and system architectures. At the recent SPIE Advanced Lithography conference, Mark Phillips, director of lithography hardware and solutions at Intel, reiterated the company’s intention to deploy the technology in high... » read more

Shortages Spark Novel Component Lifecycle Solutions
By Laura Peters - 19 May, 2022 - Comments: 0

The semiconductor industry’s supply chain problems are prompting some innovative solutions and workarounds, and while they don't solve all problems, they are improving efficiency and extending equipment lifetimes. The shortages, which affect everything from the chips used in automotive, IoT, and consumer ICs to the equipment used to manufacture and test them — span global supply lines. T... » read more

A Guide To Fast Optimal Solutions To Complex Problems For Quantum Computers
By TEL - 18 May, 2022 - Comments: 0

Most people have already heard the term “quantum computer.” There has been a lot of interest in quantum computers over the last few years, with great expectations that they will dramatically change the world soon. These days, we use computers all the time in our daily lives. Personal computers and smartphones are obvious computers, but there are many more computers hidden in plain sight aro... » read more

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