Synchronous Die-to-Die Signaling Using Aeonic Connect

By Movellus - 26 Jul, 2023 - Comments: 0

This paper presents a system providing accurate clock alignment for on-die and die-to-die synchronous circuits. A low-frequency reference clock provides an accurate timing reference with low power consumption, while distributed delay lines align the endpoints of loosely constrained clock trees. For on-die clocks, this synchronization strategy severs the traditional relationship between power an... » read more

GUC GLink Test Chip Uses In-Chip Monitoring And Deep Data Analytics For High Bandwidth Die-To-Die Characterization

By proteanTecs - 11 Oct, 2022 - Comments: 0

Advanced ASIC leader Global Unichip Corp (GUC) has developed GLink, a high-bandwidth, low-latency, and power-efficient die-to-die (D2D) interface. GLink offers the industry’s highest optimized interconnect solution for both CoWoS and InFO packaging technologies. The GUC and proteanTecs collaboration started with GUC’s second generation of GLink, known as GLink 2.0. The project target was... » read more

The Increasingly Ordinary Task Of Verifying RISC-V

By Ann Mutschler - 03 Jun, 2020 - Comments: 0

As RISC-V processor development matures and its usage in SoCs and microcontrollers grows, engineering teams are starting to look beyond the challenges of the processor core itself. So far, the majority of industry verification efforts have focused on ISA compliance to standardize the RISC-V core. Now the focus is shifting to be how to handle verification as the system grows, especially as this... » read more

Test Chips Play Larger Role At Advanced Nodes

By Ann Mutschler - 27 Jun, 2019 - Comments: 0

Test chips are becoming more widespread and more complex at advanced process nodes as design teams utilize early silicon to diagnose problems prior to production. But this approach also is spurring questions about whether this approach is viable at 7nm and 5nm, due to the rising cost of prototyping advanced technology, such as mask tooling and wafer costs. Semiconductor designers have long b... » read more

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tag: test chips

Synchronous Die-to-Die Signaling Using Aeonic Connect

GUC GLink Test Chip Uses In-Chip Monitoring And Deep Data Analytics For High Bandwidth Die-To-Die Characterization

The Increasingly Ordinary Task Of Verifying RISC-V

Test Chips Play Larger Role At Advanced Nodes