MMAF Option Enables Picoampere Measurements


By Yoshiyuki Aoki and Tsunetaka Akutagawa Demand for low-current devices is increasing, as many new sensors are being created for medical, automotive, industrial, and other applications. Chief among the heightened production and test requirements for these low-current devices is the need to achieve picoampere (pA)-class measurements. Sensors’ functionality and efficacy, especially in medic... » read more

Improving Reliability In Chips


Semiconductor Engineering sat down to discuss changes in test that address tracing device quality throughout a product’s lifetime with Tom Katsioulas, CEO at Archon Design Solutions and U.S. Department of Commerce IoT advisory board member; Ming Zhang, vice president of R&D Acceleration at PDF Solutions; and Uzi Baruch, chief strategy officer at proteanTecs. What follows are excerpts of t... » read more

Using Generative AI To Connect Lab To Fab Test


Executive Insight: Thomas Benjamin, CTO at National Instruments, sat down with Semiconductor Engineering to discuss a new way of looking at test, using data as a starting point and generative AI as a bridge between different capabilities. SE: What are the big changes you're seeing and how is that affecting movement of critical data from the lab to the fab? Benjamin: If you walk into any m... » read more

Sustainable Products For A More Sustainable World


Teradyne’s sustainability journey began three decades ago with a focus on minimizing the environmental impact of our buildings and infrastructure, as outlined in our two part blog series (check out part one and part two). This effort also includes a focus on making our products more sustainable. In this blog, learn how Teradyne’s products and efforts are contributing to a more sustainabl... » read more

Semiconductor Industry Is Pulling AI Across A Diversity Of End Uses And Applications


Earlier this month, I had the pleasure of joining a group of industry peers during SEMICON West and the Design Automation Conference in San Francisco for an enlightening panel discussion that we organized titled, “How AI Is Reinventing the Semiconductor Industry Inside and Out.” Moderated by Gartner, I was joined on the panel by senior executives from Advantest, Synopsys and the TinyML Foun... » read more

Reducing Chip Test Costs With AI-Based Pattern Optimization


The old adage “time is money” is highly applicable to the production testing of semiconductor devices. Every second that a wafer or chip is under test means that the next part cannot yet be tested. The slower the test throughput, the more automatic test equipment (ATE) is needed to meet production throughput demands. This is a huge issue for chip producers, since high pin counts, blazingly ... » read more

How Software Can Help Redefine Semiconductor Validation


The rate of technological advancement is increasing faster than ever before. Although the demands for meeting aggressive time-to-market requirements and innovating at warp speed are not new, they are continuing to accelerate. To cut costs without compromising product quality, engineers are now expected to test new designs more rapidly at various stages of development. Even though many organizat... » read more

How ADAS and EVs Drive Semiconductor-To-Automotive Supply Chain Innovation


As EV and ADAS become the focus for the automotive industry, the supply chain is going through a transformation. The industry is keenly reminded of recent semiconductor shortages as well as the growing semiconductor content requirements per vehicle.  This prompts the entire supply chain including traditional semiconductor suppliers, Tier-1s, and automotive OEMs to rethink their strategies not ... » read more

Verification And Test Of Safety And Security


Functional verification can cost as much as design, but new capabilities are piling onto an already stressed verification methodology, leaving solutions fragmented and incomplete. In a perfect world, a semiconductor device would be verified to operate according to its complete specification, and continue to operate correctly over the course of its useful life. The reality, however, is this i... » read more

EDA’s Role Grows For Preventing And Identifying Failures


The front end of design is becoming more tightly integrated with the back end of manufacturing, driven by the rising cost and impact of failures in advanced chips and critical applications. Ironically, the starting point for this shift is failure analysis (FA), which typically happens when a device fails to yield, or worse, when it is returned due to some problem. In production, that leads t... » read more

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