How ADAS and EVs Drive Semiconductor-To-Automotive Supply Chain Innovation

By Joey Tun - 27 Jun, 2023 - Comments: 0

As EV and ADAS become the focus for the automotive industry, the supply chain is going through a transformation. The industry is keenly reminded of recent semiconductor shortages as well as the growing semiconductor content requirements per vehicle. This prompts the entire supply chain including traditional semiconductor suppliers, Tier-1s, and automotive OEMs to rethink their strategies not ... » read more

Verification And Test Of Safety And Security

By Brian Bailey - 22 Jun, 2023 - Comments: 0

Functional verification can cost as much as design, but new capabilities are piling onto an already stressed verification methodology, leaving solutions fragmented and incomplete. In a perfect world, a semiconductor device would be verified to operate according to its complete specification, and continue to operate correctly over the course of its useful life. The reality, however, is this i... » read more

EDA’s Role Grows For Preventing And Identifying Failures

By Karen Heyman - 08 Jun, 2023 - Comments: 0

The front end of design is becoming more tightly integrated with the back end of manufacturing, driven by the rising cost and impact of failures in advanced chips and critical applications. Ironically, the starting point for this shift is failure analysis (FA), which typically happens when a device fails to yield, or worse, when it is returned due to some problem. In production, that leads t... » read more

From Lab To Fab: Increasing Pressure To Fuse IC Processes

By Gregory Haley - 06 Jun, 2023 - Comments: 0

Test, metrology, and inspection are essential for both the lab and the fab, but fusing them together so that data created in one is easily transferred to the other is a massive challenge. The chip industry has been striving to bridge these separate worlds for years, but the economics, speed, and complexity of change require a new approach. The never-ending push toward smaller, better-defined... » read more

Ramping Up Power Electronics For EVs

By Anne Meixner - 06 Jun, 2023 - Comments: 0

The rapid acceleration of the power devices used in electric vehicles (EVs) is challenging chipmakers to adequately screen the ICs that power these vehicles.[1] While progress toward autonomous driving is grabbing the public’s attention, the electrification of transportation systems is progressing quietly. For the automotive industry, this shift involves a mix of electronic components. Amo... » read more

Power-Supply Card Targets High-Voltage PMIC Test

By Toni Dircherl - 06 Jun, 2023 - Comments: 0

The electronics industry is seeing a move toward higher voltages and currents to deliver sufficient supply and charging power in products ranging from handheld cellphones and tablets to workstations. This trend is evidenced in examples such as the many USB power-delivery (PD) profiles with ratings ranging from 10W (5V at 2A for USB PD 3.0 profile 1) up to 100W (5V at 2A, 12V at 5A, and 20V at 5... » read more

Testing High Power Discrete Devices

By Tom Tran - 06 Jun, 2023 - Comments: 0

Emerging markets are driving the evolution of discrete power devices. Increased power requirements mean more power is being driven through a smaller device, creating challenges in both device design and test. This video series, 3 for 3, provides 3 answers for 3 pressing questions about trends in semiconductor test, and how testing for high power discrete devices is evolving. » read more

From Known Good Die To Known Good System With UCIe IP

By Manuel Mota - 11 May, 2023 - Comments: 0

Multi-die systems are made up of several specialized functional dies (or chiplets) that are assembled in the same package to create the complete system. Multi-die systems have recently emerged as a solution to overcome the slowing down of Moore’s law by providing a path to scaling functionality in the packaged chip in a way that is manufacturable with good yield. Additionally, multi-die sy... » read more

Data Analytics For The Chiplet Era

By Shinji Hioki - 09 May, 2023 - Comments: 0

This article is based on a paper presented at SEMICON Japan 2022. Moore’s Law has provided the semiconductor industry’s marching orders for device advancement over the past five decades. Chipmakers were successful in continually finding ways to shrink the transistor, which enabled fitting more circuits into a smaller space while keeping costs down. Today, however, Moore’s Law is slowin... » read more

The Data Revolution Of Semiconductor Production

By Nitza Basoco - 09 May, 2023 - Comments: 0

During our insightful panel discussion on “The Data Revolution of Semiconductor Production – How Advancements in Technology Unlock New Insights,” we covered several topics including machine learning, edge computing and cloud-based data management. We discussed questions including: Are we creating the right data and doing enough with it? What needs to be done to make data actionable? Ho... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

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