Chip Industry Week in Review
EDA export controls; Synopsys-Ansys divest requirements; SIA Factbook; McKinsey effects of tariffs; ASE's fan-out bridge; earnings; TSMC's design center; China's legacy chips play; AMD's optical acquisition.
Chip Industry Week in Review
IC, AI global ranking; China's fully automated IC design system; Micron goes bigger; PCIe 7.0 spec; TSMC-Tokyo joint lab; panel-level packaging win; first neuromorphic compute system; GAA forksheets; AMD's new GPUs.
RISC-V’s Increasing Influence
Does the world need another CPU architecture when that no longer reflects the typical workload? Perhaps not, but it may need a bridge to get to where it needs to be.
Chip Industry Week in Review
China's 3nm chip; state of the industry supply chain; imec's next big push; hyper-dimensional AI chip; OpenAI's $6.5B startup deal; Siemens buys Excellicon; chip revenue challenges; France's new OSAT.
Co-Packaged Optics Reaches Power Efficiency Tipping Point
But blazing fast data speeds come with significant manufacturing challenges.
Startup Funding: Q1 2025
AI chips and data center communications see big funding; 75 startups raise $2 billion.
Advanced Packaging Fundamentals for Semiconductor Engineers
New SE eBook examines the next phase of semiconductor design, testing, and manufacturing.
Chip Industry Week in Review
AI export rule to be scrapped; SEMI, EU request; Cadence, Nvidia supercomputer; AI co-processor; Imagination's new GPU; semi sales up; imec, TNO photonics lab; NSF key to national security; flexible packaging control system; SiConic test engineering; USB 4 support; SiC JFETS; magnetic behavior in hematite.
Chip Industry Week in Review
EDA export controls; Synopsys-Ansys divest requirements; SIA Factbook; McKinsey effects of tariffs; ASE's fan-out bridge; earnings; TSMC's design center; China's legacy chips play; AMD's optical acquisition.
Linear Pluggable Optics Save Energy In Data Centers
New OIF electrical standards will enable interoperability, adding another option for faster and more efficient data movement.
What Exactly Are Chiplets And Heterogeneous Integration?
New technologies drive new terminology, but the early days for those new approaches can be very confusing.
Big Changes Ahead For Interposers And Substrates
New materials and processes will help with power distribution and thermal dissipation in advanced packages.
Three-Way Race To 3D-ICs
Intel, TSMC, and Samsung are developing a broad set of technologies and relationships that will be required for the next generation of AI chips.
