Blog Review: Oct. 21

By Jesse Allen - 21 Oct, 2015 - Comments: 0

Ansys' Bill Vandermark goes back to the future in this week's top five picks. Plus, the star of the world's longest hoverboard flight gets an upgrade. Perhaps the person riding it will be wearing an ocean-cleaning bikini. Straight from MemCon 2015, Rambus' Aharon Etengoff brings us a keynote exploring the increasingly blurred lines between memory and storage, and how an alternative paradigm ... » read more

Blog Review: Sept. 30

By Jesse Allen - 30 Sep, 2015 - Comments: 0

In an increasingly networked world, NXP's Lars Reger advocates for a change of perspective: one which places data protection and the security of end customers and users at the heart. Differential power analysis has been on the mind of Rambus' Aharon Etengoff recently as increasing numbers of SIM cards are being cracked, plus some counter measures that can be used. Even wondered about the ... » read more

Blog Review: Sept. 23

By Jesse Allen - 23 Sep, 2015 - Comments: 0

From the International Motor Show (IAA) in Frankfurt, NXP's Birgit Ahlborn brings us a discussion with on the challenges to building trust in connected cars and intelligent transport systems, and what is needed to ensure security in a world of connected mobility. From the world's largest aircraft to terahertz wireless to the launch of a partially reusable orbital rocket, innovation is in the... » read more

Blog Review: May 7

By Ed Sperling - 07 May, 2014 - Comments: 0

What if your toothbrush could talk? Semico Research’s Michell Prunty looks at the crowd-funded connected toothbrush design. And what else can it do? Cadence’s Richard Goering attended the Electronic Design Process Symposium in Monterey and summed up the progress in ESL: Power is less of an issue (for the moment), emulation is cheaper, but there is still a dearth of expertise and standard... » read more

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Knowledge Centers
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Intel Vs. Samsung Vs. TSMC

Foundry competition heats up in three dimensions and with novel technologies as planar scaling benefits diminish.

by Ed Sperling

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Chip Industry Week In Review

Softbank's acquisition; advanced packaging funding; glass substrates; engineered copper wire; semi equipment set new record; HBM4; AI chips rake in funding; X-ray inspection; apprenticeships.

by The SE Staff

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

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Blog Review: Oct. 21

Blog Review: Sept. 30

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Blog Review: May 7

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