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Multiphysics Simulations for AI Silicon to System Success


Achieving power efficiency, power integrity, signal integrity, thermal integrity and reliability is paramount for enabling product success by overcoming the challenges of size and complexity in AI hardware and optimizing the same for rapidly evolving AI software. ANSYS’ comprehensive chip, package and system solutions empower AI hardware designers by breaking down design margins and siloed de... » read more

HBM Upstages DDR In Bandwidth, Power


For graphics, networking, and high performance computing, the latest iteration of high-bandwidth memory (HBM) continues to rise up as a viable contender against conventional DDR, GDDR designs, and other advanced memory architectures such as the Hybrid Memory Cube. [getkc id="276" kc_name="HBM"] enables lower power consumption per I/O and higher bandwidth memory access with a more condensed f... » read more