tag: thermal management

Cooling Chips Still A Top Challenge
By Bryon Moyer - 22 May, 2025 - Comments: 0

Increasing levels of semiconductor integration means more work needs to be done in smaller spaces, which in turn generates more heat that needs to be dissipated. Managing heat dissipation in advanced node dies and in multi-die assemblies is critical to their functionality and their longevity. And while much of the focus has been on improving power efficiency, which reduces the rate of power ... » read more

Optimization Approach For The Dispensing of Thermal Interface Material (KIT, Robert Bosch)
By Technical Paper Link - 21 May, 2025 - Comments: 0

A new technical paper titled "TIMtrace: Coverage Path Planning for Thermal Interface Materials" was published by researchers at Karlsruhe Institute of Technology (KIT) and Robert Bosch GmbH. Abstract "Thermal Interface Materials are used to transfer heat from a semiconductor to a heatsink. They are applied along a dispense path onto the semiconductor and spread over its entire surface once ... » read more

Floorplanning Method For Reducing Thermally-Induced Structural Stress In Chiplet Packages (Penn State, Intel, ASU et al.)
By Technical Paper Link - 14 May, 2025 - Comments: 0

A new technical paper titled "STAMP-2.5D: Structural and Thermal Aware Methodology for Placement in 2.5D Integration" was published by researchers at Pennsylvania State University, Intel, Arizona State University and University of Notre Dame. Abstract "Chiplet-based architectures and advanced packaging has emerged as transformative approaches in semiconductor design. While conventional ph... » read more

Innovation And Collaboration In Power Module Packaging: A Thermal Perspective
By Thomas Wang - 17 Apr, 2025 - Comments: 0

Power modules are the foundation of modern electrical systems, especially within electric vehicles (xEVs), industrial motor applications, and renewable energy solutions such as wind and solar power. As the demand for more power in smaller and lighter systems grows, managing heat dissipation has become a major challenge, as the thermal energy from high current flows can lead to reliability issue... » read more

Chiplets Add New Power Issues
By Ann Mutschler - 13 Mar, 2025 - Comments: 0

Delivering and managing power are becoming key challenges in the rollout of chiplets, adding significantly to design complexity and forcing chipmakers to weigh tradeoffs that can have a big impact on the performance, reliability, and the overall cost of semiconductors. Power is a concern for every chip and chiplet design, even if the specifics differ based on the application. Systems vendors... » read more

Thermally Aware Chiplet Placement Algorithm Based on Automatic Differentiation (MIT, IBM)
By Technical Paper Link - 07 Mar, 2025 - Comments: 0

A new technical paper titled "DiffChip: Thermally Aware Chip Placement with Automatic Differentiation" was published by researchers at MIT and IBM. Abstract "Chiplets are modular integrated circuits that can be combined to form a larger system, offering flexibility and performance enhancements. However, their dense packing often leads to significant thermal management challenges, requiring ... » read more

Lines Blurring Between Supercomputing And HPC
By Ann Mutschler - 27 Feb, 2025 - Comments: 1

Supercomputers and high-performance computers are becoming increasingly difficult to differentiate due to the proliferation of AI, which is driving huge performance increases in commercial and scientific applications and raising similar challenges for both. While the goals of supercomputing and high-performance computing (HPC) have always been similar — blazing fast processing — the mark... » read more

Signal Integrity Plays Increasingly Critical Role In Chiplet Design
By Ann Mutschler - 13 Feb, 2025 - Comments: 1

Maintaining the quality and reliability of electrical signals as they travel through interconnects is proving to be much more challenging with chiplets and advanced packaging than in monolithic SoCs and PCBs. Signal integrity is a fundamental requirement for all chips and systems, but it becomes more difficult with chiplets due to reflections, loss, crosstalk, process variation, and various ... » read more

Direct-To-Chip Liquid-Cooled Data Centers (Binghamton, Nvidia)
By Technical Paper Link - 22 Nov, 2024 - Comments: 0

A new technical paper titled "Parameters of performance: A deep dive into liquid-to-air CDU assessment" was published by researchers at Binghamton University-SUNY and NVIDIA. Abstract: "The rapid growth in data center workloads and the increasing complexity of modern applications have led to significant contradictions between computational performance and thermal management. Traditional air... » read more

Managing The Huge Power Demands Of AI Everywhere
By Ann Mutschler - 14 Nov, 2024 - Comments: 1

Before generative AI burst onto the scene, no one predicted how much energy would be needed to power AI systems. Those numbers are just starting to come into focus, and so is the urgency about how to sustain it all. AI power demand is expected to surge 550% by 2026, from 8 TWh in 2024 to 52 TWh, before rising another 1,150% to 652 TWh by 2030. Commensurately, U.S. power grid planners have do... » read more

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