Managing Worst Case Power Conditions


With each new technology node, especially FinFET, the dynamic conditions within a chip are changing and becoming more complex in terms of process speeds, thermal activity and supply variation. Dennard scaling brought about the ability for power to be scaled down with each successive node so that power per unit area stayed roughly constant. However, as highlighted by John Hennessy at last y... » read more

New Approaches For Dealing With Thermal Problems


New thermal monitoring, simulation and analysis techniques are beginning to coalesce in chips developed at leading-edge nodes and in advanced packages in order to keep those devices running at optimal temperatures. This is particularly important in applications such as AI, automotive, data centers and 5G. Heat can kill a chip, but it also can cause more subtle effects such as premature aging... » read more