The Week in Review: IoT

By Jeff Dorsch - 02 Feb, 2018 - Comments: 0

Finance San Francisco-based Aquabyte has raised $3.5 million in seed funding led by Costanoa Ventures and New Enterprise Associates. Princeton University and strategic investors in the U.S. and Norway also participated in the round. The startup is using computer vision and machine learning to optimize efficiency in fish farming. Aquabyte is first deploying its technology in Norway in cooperati... » read more

Driving By Ethernet

By Ann Mutschler - 01 Feb, 2018 - Comments: 0

The race to add more sophisticated and safety-critical electronics into cars is forcing carmakers to revisit the communications systems within increasingly electrified and connected vehicles. Until very recently, communication between components within a vehicle was simplistic, and communication between vehicles was non-existent. All of that is changing quickly. Rapid and secure communicatio... » read more

Meanwhile, Back In Barcelona…

By Kyle Voosen - 06 Nov, 2017 - Comments: 0

We recently wrapped up another successful IoT Solutions World Congress (IoTSWC), hosted by the Industrial Internet Consortium (IIC) in Barcelona. We’ve been participating in the Congress since its inception three years ago, and this year was particularly exciting given the Catalonia Independence Referendum happening at the same time. Even with this as a backdrop, the event attracted 50 percen... » read more

Using Automotive-Ready IP To Accelerate SoC Development

By Ron DiGiuseppe - 13 Aug, 2015 - Comments: 0

IP suppliers play a key role in the automotive supply chain to enable high-performance advanced driver assistance system (ADAS) SoCs. Vision-based SoCs may contain a high amount of third-party IP to implement the key embedded vision, sensor fusion, multimedia, security and advanced connectivity functions. And while IP suppliers have permeated the semiconductor ecosystem for consumer, mobile, PC... » read more

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Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: time-sensitive networking

The Week in Review: IoT

Driving By Ethernet

Meanwhile, Back In Barcelona…

Using Automotive-Ready IP To Accelerate SoC Development

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