tag: Tokyo Electron Ltd.

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 04 Jun, 2021 - Comments: 0

Pervasive computing — IoT, edge, cloud, data center, and back To simplify IoT workflows, Arm announced that it is putting parts of its Common Microcontroller Software Interface Standard (CMSIS) into an open project called Open-CMSIS-Pack. The CMSIS is a vendor-independent abstraction layer for MCUs, especially Arm Cortex-M processors, that makes it possible for developers to deal with softwa... » read more

Deals That Change The Chip Industry
By Ed Sperling - 28 Sep, 2020 - Comments: 0

Nvidia's pending $40 billion acquisition of Arm is expected to have a big impact on the chip world, but it will take years before the effects of this deal are fully understood. More such deals are expected over the next couple of years due to several factors — there is a fresh supply of startups with innovative technology, interest rates are low, and market caps and stock prices of buyers ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 12 Jan, 2018 - Comments: 0

Chipmakers Intel and Micron have ended their long-running NAND joint development partnership. The companies will continue to develop NAND, but they will work independently on future generations of 3D NAND. The companies have agreed to complete the development of their third-generation of 3D NAND technology, which will be delivered towards the end of 2018. That is expected to be a 96-layer ... » read more

Fractilia: Pattern Roughness Metrology
By Mark LaPedus - 21 Feb, 2017 - Comments: 1

A new startup has emerged and unveiled a technology that addresses one of the bigger but less understood problems in advanced lithography--pattern roughness. The startup, called Fractilia, is a software-based metrology tool that analyzes the CD-SEM images of pattern roughness on a wafer. Fractilia, a self-funded startup, is led by Chris Mack and Ed Charrier. Mack, known as the gentleman sc... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 01 Jul, 2016 - Comments: 0

Fab tools Applied Materials has officially rolled out the Producer Selectra system, a selective etch tool. The system falls under the loosely defined category called atomic layer etch (ALE). Applied’s technology addresses a number of challenges. Today’s advanced chips have complex structures. They may also have deep and narrow trenches. One of the challenges is the inability of wet ... » read more

Fab Tool Biz Looks Cloudy
By Mark LaPedus - 17 Dec, 2015 - Comments: 1

Amid a slowdown in the foundry and DRAM sectors, the outlook for the semiconductor equipment industry looks somewhat cloudy, if not challenging, in 2016. In fact, for equipment vendors, 2016 could resemble the lackluster year in 2015. In 2015, for example, capital spending in the foundry sector fell during the year, although NAND flash began to pick up steam. In 2015, though, the big stor... » read more

Fab Tool Biz Faces Challenges In 2015
By Mark LaPedus - 11 Dec, 2014 - Comments: 0

After a slight downturn in 2013, the semiconductor equipment industry rebounded and experienced a solid upturn in 2014. The recovery was primarily driven by tool spending in the foundry and [getkc id="93" kc_name="DRAM"]sectors. Another big and ongoing story continued to unfold in 2014. In late 2013, [getentity id="22817" e_name="Applied Materials"] announced a definitive agreement to acquir... » read more

DSA: Hype Or Revolution?
By Michael Watts - 14 Aug, 2014 - Comments: 0

Directed self-assembly (DSA) has become the subject of a great deal of research attention in the lithography world, to the point where there were dedicated sessions at this year’s Advanced Lithography conference in February. So is this just another passing research fad, or is it a technology that will revolutionize semiconductor manufacturing? DSA utilizes a block copolymer that effectivel... » read more

The Bumpy Road To FinFETs
By Mark LaPedus - 15 May, 2014 - Comments: 2

The shift from planar transistors to finFETs is a major inflection point in the IC industry. FinFETs are expected to enable higher performance chips at lower voltages. And the next-generation transistor technology also could allow the industry to extend CMOS to the 10nm node and perhaps beyond. But as it turns out, finFET technology is also harder to master than previously thought. For exam... » read more

Directed Self-Assembly Gains Momentum
By Mark LaPedus - 20 Mar, 2014 - Comments: 0

At last year’s SPIE Advanced Lithography symposium, directed self-assembly (DSA) grabbed the spotlight as chipmakers provided the first glimpse of their initial work and results with the technology. The results were stunning, thereby propelling DSA from a curiosity item to a possible patterning solution for next-generation devices. Last year, in fact, GlobalFoundries, IBM, Intel and Sams... » read more

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