tag: Toshiba

LED Firms Mull New Wafer Sizes And Materials
By Ed Sperling - 16 Aug, 2012 - Comments: 0

By Mark LaPedus Seeking to reduce the cost of solid-state lighting and related applications, LED manufacturers are taking a page from the IC industry: They are looking at larger wafer sizes and new materials in the fab. Today, the state-of-the-art LED fab is a 150mm (6-inch) facility, but a large percentage of these plants are still using 50mm (2-inch) substrates. The vast majority of LED s... » read more

What’s After NAND Flash?
By Ed Sperling - 16 Aug, 2012 - Comments: 0

By Mark LaPedus For years, many have predicted the end of flash memory scaling, particularly NAND, but the technology continues to defy the odds as it moves down the process curve. Still, there are signs that the floating gate structure in today’s flash memory is on its last legs. The floating gate is seeing an undesirable reduction in the control gate to capacitive coupling ratio. And ... » read more

New Entrants Seek Niches in NAND Flash Fray
By Ed Sperling - 03 Apr, 2012 - Comments: 0

By Mark LaPedus For some time, the NAND flash market has been primarily dominated by five vendors: Micron, Samsung, SanDisk, SK Hynix and Toshiba. Other vendors have been seeking to get a foothold in the exploding market — with little or no luck. Intel Corp. and Powerchip Semiconductor Corp. have separately experienced limited success in NAND. And Elpida Memory Inc. and Spansion Inc. are... » read more

Tri-Gate’s Fallout
By Ed Sperling - 26 May, 2011 - Comments: 0

By David Lammers Intel Corp. dropped a rock into the pond of transistor technology when it announced its 22nm tri-gate technology in San Francisco earlier this month. The ripples continue to move out from that event, with impacts on IDMs, foundries, and fabless semiconductor companies being closely studied. Now that Intel has come out of the closet with its tri-gate technology, “the found... » read more

Stressing Over 3D
By Ed Sperling - 24 Jun, 2010 - Comments: 0

By David Lammers Pol Marchal recalls putting a stacked 3D prototype on his desk at IMEC in Leuven, Belgium, last year, which a visitor picked up and examined two months later. “I don’t think this chip will work,” the visitor said, causing Marchal, principal scientist at IMEC’s 3D system integration program, to put the stacked die under a microscope. Sure enough, Pol found that mechanic... » read more

Outsourcing’s New Face
By Ed Sperling - 29 Oct, 2009 - Comments: 0

By Ed Sperling As the semiconductor industry digs out from one of the worst downturns in decades, the business of semiconductor design and engineering is changing. While the architecture and features are still being developed by chip companies, the actual work of developing the chip increasingly is being done by third parties. Outsourcing is hardly new concept in business. In the early pa... » read more

Who’s In Control Now?
By Ed Sperling - 31 Jul, 2009 - Comments: 0

By Ed Sperling Power is shifting across the design industry in multiple ways and sometimes across multiple continents, driven by complexity and cost pressures and entirely new forms of competition. On one side of the equation, foundries are dictating more of what goes on up front in the design cycle. Design for manufacturing is a prerequisite at 45nm and below, and they’re the ones dictatin... » read more

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