tag: TrendForce

The Darker Side Of Consolidation
By Ed Sperling - 02 Jul, 2018 - Comments: 1

Another wave of consolidation is underway in the semiconductor industry, setting the stage for some high-stakes competitive battles over market turf and sowing confusion across the supply chain about continued support throughout a product's projected lifetime. The consolidation comes as chipmakers already are grappling with rising complexity, the loss of a roadmap for future designs as Moore... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 08 Jun, 2018 - Comments: 0

Fab tools Applied Materials has launched a suite of products that will enable cobalt metallization schemes for contacts and interconnects in chips at advanced nodes. The products from Applied enable a complete cobalt fill process. The tools include CMP, CVD, PVD and RTP systems. At advanced nodes, cobalt promises to reduce unwanted resistance in the critical parts of a chip. Cobalt is bein... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 13 Apr, 2018 - Comments: 0

R&D Late last month, the U.S. Congress finalized the federal spending for the remainder of the fiscal year. This includes R&D spending as well. “There was grave concern over the future of federal spending with the release of the president’s FY 2018 budget, which would have cut the National Science Foundation (NSF) budget by 11% and National Institutes of Standards & Technology (NIST) spend... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 30 Mar, 2018 - Comments: 0

Chipmakers 3D NAND continues to gain steam, but is the industry headed towards a capacity glut in the overall NAND market? Time will tell. In any case, Toshiba is moving forward with its plans to invest in its Fab 6 facility in Japan. The fab will produce the company’s 96-layer 3D NAND devices. Then, Samsung plans to invest $7 billion to double the production capacity for NAND flash memor... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 09 Mar, 2018 - Comments: 0

Chipmakers and OEMs After more than four years as chief executive of GlobalFoundries, Sanjay Jha will hand over the company’s top position to Thomas Caulfield, senior vice president and general manager at the foundry vendor. Caulfield, who joined GlobalFoundries in 2014, will become CEO. He has been running the company's fab in New York. "Jha intends to work closely with the company’s shar... » read more

Will China Succeed In Memory?
By Mark LaPedus - 19 Feb, 2018 - Comments: 5

China's fledging memory makers are expected to reach a major milestone and move into initial production this year, although vendors are already running into various roadblocks. China's domestic vendors are focusing on two markets, 3D NAND and DRAM. In both cases local vendors are either behind in technology, struggling to develop these products, or both. And one vendor recently was hit with ... » read more

5 Takeaways From ISS 2018
By Mark LaPedus - 15 Feb, 2018 - Comments: 0

At the recent Industry Strategy Symposium (ISS) in Half Moon Bay, Calif., there were a multitude of presentations on a number of subjects. The event, sponsored by SEMI, had presentations on the outlook for ICs and equipment. As part of the program, ISS also discussed the latest business and technology trends. In no particular order, here are my five takeaways from ISS: Ranging forecasts ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 09 Feb, 2018 - Comments: 0

Chipmakers China has struck again, as the nation continues to acquire semiconductor technology. In December, Silicon Labs announced plans to acquire Sigma Designs for $282 million. The deal involves Sigma’s Z-Wave chip business. Now, Sigma Designs has sold its connectivity chip business unit to Integrated Silicon Solution Inc. (ISSI). In 2015, a Chinese consortium of investors led by Uph... » read more

Foundry Challenges in 2018
By Mark LaPedus - 27 Dec, 2017 - Comments: 6

The silicon foundry business is expected to see steady growth in 2018, but that growth will come with several challenges. On the leading edge, GlobalFoundries, Intel, Samsung and TSMC are migrating from the 16nm/14nm to the 10nm/7nm logic nodes. Intel already has encountered some difficulties, as the chip giant recently pushed out the volume ramp of its new 10nm process from the second half ... » read more

Will Fab Tool Boom Cycle Last?
By Mark LaPedus - 18 Dec, 2017 - Comments: 2

Fab equipment spending is on pace for a record year in 2017, and it now appears that momentum could continue into 2018. Fab tool vendors found themselves in the midst of an unexpected boom cycle in 2017, thanks to enormous demand for equipment in [getkc id="208" comment="3D NAND"] and, to a lesser degree, [getkc id="93" kc_name="DRAM"]. In the logic/foundry business, however, equipment deman... » read more

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