Inside The OSAT Business

By Mark LaPedus - 17 Mar, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss the IC-packaging industry, foundries, China and other topics with Tien Wu, chief operating officer at Taiwan's Advanced Semiconductor Engineering (ASE), the world's largest outsourced semiconductor assembly and test (OSAT) vendor. What follows are excerpts of that conversation. SE: What is your overall outlook for 2016? Wu: Last year, the semi... » read more

Consolidation Hits OSAT Biz

By Mark LaPedus - 18 Feb, 2016 - Comments: 0

The outsourced semiconductor assembly and test (OSAT) industry is undergoing a new wave of acquisition activity that will dramatically reshape the packaging and test services markets. [getkc id="83" kc_name="OSATs"] have seen a considerable amount of consolidation over the years, but the industry needs a scorecard to keep track of the recent deals and the resulting fallout. One OSAT deal inv... » read more

Inside Advanced Packaging

By Mark LaPedus - 18 Feb, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss advanced IC-packaging, the OSAT industry, China and other topics with Ron Huemoeller, vice president of worldwide R&D at Amkor. What follows are excerpts of that conversation. SE: Where are we in advanced IC-packaging today? Huemoeller: We’ve hit the inflection point. Now we are coming to the other side of it. Regarding this need to int... » read more

Knowledge Centers
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3.5D: The Great Compromise

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Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

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tag: Tsinghua Ungroup

Inside The OSAT Business

Consolidation Hits OSAT Biz

Inside Advanced Packaging