tag: Tsinghua Unigroup

Week In Review: Semiconductor Manufacturing, Test
By Karen Heyman - 22 Dec, 2022 - Comments: 0

SEMI , SEMI Europe and European Commission representatives, in consultation with semiconductor industry stakeholders, proposed initiatives to overcome the skills shortage in Europe’s microelectronics industry: Create an industry image campaign to raise public awareness on how technology is shaping the future, and how workers can establish careers in the semiconductor industry. Remove ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 08 Apr, 2022 - Comments: 0

Synopsys and Juniper Networks are forming a new, separate company that will provide the industry with an open silicon photonics platform that will include integrated lasers, optical amplifiers, and a full suite of photonic components to form a complete solution that will be accessible through a Process Design Kit (PDK). The new company is being formed, in part, from the carve-out of integrated ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 28 Jan, 2022 - Comments: 0

Government policy As reported, the United States is in dire need of more fab capacity as well as packaging plants. The U.S. took a big step in an effort to solve the problem. The U.S. House of Representatives this week introduced the America Competes Act of 2022. The bill includes funding for the Creating Helpful Incentives to Produce Semiconductors for America (CHIPS) Act, which is earmarked... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 17 Dec, 2021 - Comments: 0

Chipmakers Chip investments in Malaysia got a shot in the arm this week. First, Intel has announced plans to invest more than RM30 billion, or US$7 billion, within its Malaysian packaging and test facilities. The additional investment will help expand Intel Malaysia’s operations across Penang and Kulim. This new investment is expected to create over 4,000 Intel jobs as well as over 5,000 con... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 10 Dec, 2021 - Comments: 0

Semicon West news The Semicon West trade show opened this week with a hybrid in-person and virtual event. Several companies introduced new products or made announcements at Semicon. Some announcements coincided with the show. At Semicon, Lam Research introduced the Syndion GP, a new product that provides deep silicon etch capabilities to chipmakers developing next-generation power devices a... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 19 Nov, 2021 - Comments: 0

Chipmakers China’s Tsinghua Unigroup is in trouble. The group is the parent company of China’s YMTC, a 3D NAND supplier, and other chip ventures. It is close to moving into bankruptcy proceedings. Now, a consortium led by Alibaba has emerged as the frontrunner to take over Tsinghua Unigroup, according to a report from Bloomberg. That deal would keep the company afloat, the report said. ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 16 Jul, 2021 - Comments: 0

Tools Andes Technology certified Imperas reference models for the complete range of Andes IP cores with the new RISC-V P SIMD/DSP extension. The reference models can be used to evaluate multicore design configuration options for SoC architecture exploration and support early software development before silicon prototypes are available. Cadence's digital full flow was optimized and certified... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 09 Jul, 2021 - Comments: 0

Chipmakers and OEMs China has been working on compound semiconductors, such as gallium-nitride (GaN) and silicon carbide (SiC). Now, a China-backed company has taken a big step in the SiC and related markets. Chip supplier Nexperia, a subsidiary of China’s Wingtech Technology, has acquired Newport Wafer Fab (NWF), a U.K.-based manufacture of power and compound semiconductors, including Si... » read more

3D NAND’s Vertical Scaling Race
By Mark LaPedus - 17 Dec, 2020 - Comments: 1

3D NAND suppliers are accelerating their efforts to move to the next technology nodes in a race against growing competition, but all of these vendors are facing an assortment of new business, manufacturing, and cost challenges. Two suppliers, Micron and SK Hynix, recently leapfrogged the competition and have taken the scaling race lead in 3D NAND. But Samsung and the Kioxia-Western Digital (... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 04 Dec, 2020 - Comments: 0

Packaging and EMS ASE is expanding its efforts in the electronic manufacturing services (EMS) business. Universal Scientific Industrial (USI), a subsidiary of ASE, has completed the acquisition of Asteelflash Group through the acquisition of its parent company, Financière. USI provides electronic design and manufacturing services. It also provides system-in-package (SiP) modules. Asteelfla... » read more

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