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Week In Review: Manufacturing, Test


Chipmakers Chip investments in Malaysia got a shot in the arm this week. First, Intel has announced plans to invest more than RM30 billion, or US$7 billion, within its Malaysian packaging and test facilities. The additional investment will help expand Intel Malaysia’s operations across Penang and Kulim. This new investment is expected to create over 4,000 Intel jobs as well as over 5,000 con... » read more

Week In Review: Manufacturing, Test


Semicon West news The Semicon West trade show opened this week with a hybrid in-person and virtual event. Several companies introduced new products or made announcements at Semicon. Some announcements coincided with the show. At Semicon, Lam Research introduced the Syndion GP, a new product that provides deep silicon etch capabilities to chipmakers developing next-generation power devices a... » read more

Week In Review: Manufacturing, Test


Chipmakers China’s Tsinghua Unigroup is in trouble. The group is the parent company of China’s YMTC, a 3D NAND supplier, and other chip ventures. It is close to moving into bankruptcy proceedings. Now, a consortium led by Alibaba has emerged as the frontrunner to take over Tsinghua Unigroup, according to a report from Bloomberg. That deal would keep the company afloat, the report said. ... » read more

Week In Review: Design, Low Power


Tools Andes Technology certified Imperas reference models for the complete range of Andes IP cores with the new RISC-V P SIMD/DSP extension. The reference models can be used to evaluate multicore design configuration options for SoC architecture exploration and support early software development before silicon prototypes are available. Cadence's digital full flow was optimized and certified... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs China has been working on compound semiconductors, such as gallium-nitride (GaN) and silicon carbide (SiC). Now, a China-backed company has taken a big step in the SiC and related markets. Chip supplier Nexperia, a subsidiary of China’s Wingtech Technology, has acquired Newport Wafer Fab (NWF), a U.K.-based manufacture of power and compound semiconductors, including Si... » read more

3D NAND’s Vertical Scaling Race


3D NAND suppliers are accelerating their efforts to move to the next technology nodes in a race against growing competition, but all of these vendors are facing an assortment of new business, manufacturing, and cost challenges. Two suppliers, Micron and SK Hynix, recently leapfrogged the competition and have taken the scaling race lead in 3D NAND. But Samsung and the Kioxia-Western Digital (... » read more

Week In Review: Manufacturing, Test


Packaging and EMS ASE is expanding its efforts in the electronic manufacturing services (EMS) business. Universal Scientific Industrial (USI), a subsidiary of ASE, has completed the acquisition of Asteelflash Group through the acquisition of its parent company, Financière. USI provides electronic design and manufacturing services. It also provides system-in-package (SiP) modules. Asteelfla... » read more

Week In Review: Manufacturing, Test


Fab tools PDF Solutions has entered into a definitive agreement to acquire Cimetrix. Under the terms, PDF will pay a cash amount of $35.0 million, net of cash on Cimetrix’s balance sheet as of closing, and subject to other closing adjustments. With the move, PDF will expand into new markets. Cimetrix is a provider of equipment connectivity products for smart manufacturing and Industry 4.0... » read more

Startup Funding: September 2020


It was a good month for startups, with big rounds in automotive, data centers, and AI. A new startup with big backing is taking aim at energy inefficiency in the data center, and another is looking to make the industrial IoT battery-free. SK Hynix founded a new company to analyze semiconductor manufacturing data, and one of China's EV companies sees a massive cash infusion. This month, we look ... » read more

DRAM Scaling Challenges Grow


DRAM makers are pushing into the next phase of scaling, but they are facing several challenges as the memory technology approaches its physical limit. DRAM is used for main memory in systems, and today’s most advanced devices are based on roughly 18nm to 15nm processes. The physical limit for DRAM is somewhere around 10nm. There are efforts in R&D to extend the technology, and ultimate... » read more

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