tag: TSMC

Week In Review: Manufacturing, Test
By Mark LaPedus - 12 Nov, 2021 - Comments: 0

Chipmakers AMD has rolled out its new MI200 series products, the first exascale-class GPU accelerators. Using a fan-out bridge packaging technology, the MI200 series are designed for high-performance computing (HPC) and artificial intelligence (AI) applications. The MI200 series accelerators feature a multi-die GPU architecture with 128GB of HBM2e memory. Typically, the HBM2e memory stack a... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 05 Nov, 2021 - Comments: 0

Packaging Amkor plans to build a packaging plant in Bac Ninh, Vietnam. The first phase of the new factory will focus on providing system-in-package (SiP) assembly and test services for customers. The investment for the first phase of the facility is estimated to be between $200 million and $250 million. “This is a strategic, long-term investment in geographical diversification and factory... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 05 Nov, 2021 - Comments: 0

Automotive The U.S. Department of Energy (DOE) is funding 25 cleaner car and truck projects with $199 million. Projects include long-haul trucks powered by batteries and fuel cells, and at improving the nation’s electric vehicle (EV) charging infrastructure. The Volvo Group North America (VGNA) will receive $18 million in federal funds under DOE’s  SuperTruck 3 Program. Daimler Trucks N... » read more

Manufacturing Bits: Nov. 2
By Mark LaPedus - 02 Nov, 2021 - Comments: 0

IRDS lithography roadmap The Journal of Micro/Nanopatterning, Materials, and Metrology (JM3) has published a paper that outlines the lithography roadmap and the various challenges for the next 15 years. The paper, called the "International Roadmap for Devices and Systems lithography roadmap," projects that extreme ultraviolet (EUV) lithography and a next-generation version will remain the m... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 29 Oct, 2021 - Comments: 0

Chipmakers After years in the works, GlobalFoundries is finally a public company. But on its first day of trading on Thursday (Oct. 28), shares of the foundry vendor slipped a bit. GF finished its first day of trading at $46.40. This compares to the $47 per share it priced in the initial public offering (IPO), according a report to Reuters. The chipmaker has a market capitalization of about $2... » read more

Week In Review: Design, Low Power
By Jesse Allen - 29 Oct, 2021 - Comments: 0

Arteris IP uncorked its initial public offering this week, a rare occurrence for a semiconductor IP vendor over the past couple decades. The stock began trading on the Nasdaq Global Market on Wednesday under the ticker symbol AIP, gaining more than 40% on its first day. Tools Codasip updated its Studio processor design toolset. Version 9.1 includes an expanded bus support with full AXI for ... » read more

Scaling Bump Pitches In Advanced Packaging
By Mark LaPedus - 25 Oct, 2021 - Comments: 0

Interconnects for advanced packaging are at a crossroads as an assortment of new package types are pushing further into the mainstream, with some vendors opting to extend the traditional bump approaches while others roll out new ones to replace them. The goal in all cases is to ensure signal integrity between components in IC packages as the volume of data being processed increases. But as d... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 22 Oct, 2021 - Comments: 0

Chipmakers Apple has introduced its latest MacBook Pro notebooks built around the company’s new, in-house designed processors, dubbed the M1 Pro and M1 Max. The chips, to be incorporated in its 14- and 16-inch MacBook Pro systems, are the most powerful devices developed by Apple. The CPUs in the M1 Pro and M1 Max chips deliver up to 70% faster performance than the first M1 device. Based ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Ed Sperling - 22 Oct, 2021 - Comments: 0

An investigation by the Automobile Association of America found that lane-keeping assist and automatic emergency braking, both high-profile ADAS features, are prone to failure in rain. According to the report, 69% of tests conducted with simulated rainfall resulted in test vehicles crossing lane markers, and 33% of simulations resulted in collisions at 35 mph. Surprisingly, risk of accidents di... » read more

Week In Review: Design, Low Power
By Jesse Allen - 22 Oct, 2021 - Comments: 0

Tools Cadence's digital and custom/analog flows were certified for TSMC's N3 and N4 process technologies. Updates for the digital flow includes efficient processing of large libraries, additional accuracy during library cell characterization and static timing analysis, and support for accurate leakage calculation required in N3 and static power calculation for new N3 cells. Synopsys' digita... » read more

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