tag: TSMC

Week In Review: Manufacturing, Test
By Linda Christensen - 24 Sep, 2021 - Comments: 1

Markets Worldwide semiconductor industry revenue is expected to grow 17.3% in 2021, compared with 10.8% in 2020, according to a new IDC report. Segment breakdown is as follows: [table id=5 /] “Semiconductor wafer prices increased in 1H21 and IDC expects increases to continue for the rest of 2021 due to material costs and opportunity cost in mature process technologies. Overall, IDC pre... » read more

Week In Review: Design, Low Power
By Jesse Allen - 17 Sep, 2021 - Comments: 0

MoSys, a provider of SRAM solutions and networking accelerators, and Peraso Technologies, a provider of 5G mmWave devices, are merging. Stockholders of Peraso are expected to hold a 61% equity interest in the combined company, with the remaining 39% equity interest to be retained by the stockholders of MoSys. Peraso CEO Ronald Glibbery said, "By joining with MoSys, we believe we can deliver a b... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 17 Sep, 2021 - Comments: 0

Automotive Arm announced a new software architecture, two reference hardware implementations, and its role leading a new industry group that will work on open-source software for automotive use. The Scalable Open Architecture for Embedded Edge (SOAFEE) is based on Arm’s Project Cassini and SystemReady, aims to help the automotive industry move to software-defined systems by tackling the comp... » read more

System-In-Package Thrives In The Shadows
By Mark LaPedus - 16 Sep, 2021 - Comments: 0

IC packaging continues to play a big role in the development of new electronic products, particularly with system-in-package (SiP), a successful approach that continues to gain momentum — but mostly under the radar because it adds a competitive edge. With a SiP, several chips and other components are integrated into a package, enabling it to function as an electronic system or sub-system. ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 03 Sep, 2021 - Comments: 1

OEMs For some time, the automotive industry has suffered due to chip shortages in the market. And the chip shortages are spreading into other markets. In the latest news, GM plans to idle key truck plants amid chip shortages, according to a report from Bloomberg. “GM said eight of its 14 North American assembly plants will experience shutdowns this month because of chip shortages, includi... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 27 Aug, 2021 - Comments: 0

Chipmakers, OEMs Reports have surfaced that TSMC has delayed its 3nm process. But TSMC says the technology remains on track. Volume production for TSMC’s 3nm is still scheduled for the second half of 2022. On the flip side, there is speculation that TSMC may increase its wafer prices by up to 20%, according to a report from the Taipei Times. Here's another report. This is due to chip shortag... » read more

New Approaches For Processor Architectures
By Ed Sperling - 26 Aug, 2021 - Comments: 0

Processor vendors are starting to emphasize microarchitectural improvements and data movement over process node scaling, setting the stage for much bigger performance gains in devices that narrowly target what end users are trying to accomplish. The changes are a recognition that domain specificity, and the ability to adjust or adapt designs to unique workloads, are now the best way to impro... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 20 Aug, 2021 - Comments: 0

Chipmakers, OEMs At Intel’s Architecture Day this week, the company revealed several new chip architectures. Some were already announced, while others are new. These include Intel’s first performance hybrid architecture, a data center architecture, a discrete gaming graphics processing unit (GPU) architecture, infrastructure processing units (IPUs), and a data center GPU architecture. Here... » read more

Optimizing VSB Shot Count For Curvilinear Masks
By Jan Willis - 19 Aug, 2021 - Comments: 0

The increased photomask write time using a variable-shape e-beam (VSB) writer has been a barrier to the adoption of inverse lithography technology (ILT) beyond the limited usage for hot spots. The second installment of this video blog looked at the challenge in depth. In this five-minute panel video with industry luminaries, Ezequiel Russell describes the collaborative study between his company... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 13 Aug, 2021 - Comments: 0

Chipmakers and OEMs Samsung has announced its latest foldable smartphones--the Galaxy Z Fold3 5G and Galaxy Z Flip3 5G. The systems are based on Samsung’s 5nm application processor. One system is the company’s most affordable foldable phone. The Galaxy Z Fold3 is $1,799.99, while the Galaxy Z Flip3 is $999.99. Samsung also announced two smartwatches—the Galaxy Watch4 and Galaxy Watch4... » read more

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