Chip Industry Week In Review


By Liz Allan, Jesse Allen, and Karen Heyman Global semiconductor equipment billings dipped 2% year-over-year to US$25.8 billion in Q2, and slipped 4% compared with Q1, according to SEMI. Similarly, the top 10 semiconductor foundries reported a 1.1% quarterly-over-quarter revenue decline in Q2. A rebound is anticipated in Q3, according to TrendForce. Synopsys extended its AI-driven EDA ... » read more

Week In Review: Manufacturing, Test


Bosch completed its acquisition of TSI Semiconductors to expand its SiC chips business, reports Reuters. In April, Bosch announced plans to invest $1.5 billion in the Roseville, California, foundry to convert TSI’s manufacturing facilities into state-of-the-art processes, with the first SiC chips due out in 2026. Bosch CEO Stefan Hartung said the full expansion "depends on the support of the... » read more

Week In Review: Manufacturing, Test


Intel aims to quadruple capacity for its most advanced chip packaging services by 2025, including with a new facility in Malaysia, per Nikkei Asia. Huawei is building a collection of secret semiconductor fabrication facilities across China to let the company skirt U.S. sanctions, SIA warned in a presentation seen by Bloomberg. It’s acquired at least two existing plants and is building at l... » read more

Securing Chip Manufacturing Against Growing Cyber Threats


Semiconductor manufacturers are wrestling with how to secure a highly specialized and diverse global supply chain, particularly as the value of their IP and their dependence upon software increases — along with the sophistication and resources of the attackers. Where methodologies and standards do exist for security, they often are confusing, cumbersome, and incomplete. There are plenty of... » read more

Week In Review: Manufacturing, Test


TSMC, Bosch, Infineon, and NXP will jointly invest in the European Semiconductor Manufacturing Co. (ESMC), in Dresden, Germany, to provide advanced semiconductor manufacturing services. ESMC marks a significant step toward construction of a 300mm fab, which is expected to have a monthly production capacity of 40,000 300mm (12-inch) wafers on TSMC’s 28/22nm planar CMOS and 16/12nm finFET proce... » read more

Chiplets: Deep Dive Into Designing, Manufacturing, And Testing


Chiplets are a disruptive technology. They change the way chips are designed, manufactured, tested, packaged, as well as the underlying business relationships and fundamentals. But they also open the door to vast new opportunities for existing chipmakers and startups to create highly customized components and systems for specific use cases and market segments. This LEGO-like approach sounds ... » read more

Week In Review: Semiconductor Manufacturing, Test


China’s restrictions on the export gallium and germanium took effect this week. Any Chinese company exporting gallium or germanium that could be used in military and civil applications (dual-use) must obtain a license from China’s Ministry of Commerce. China produces 60% of the worldwide supply of germanium and 80% of the world’s gallium, both of which have to be processed from other mate... » read more

Week In Review: Manufacturing, Test


The Chinese government is considering easing proposed rules that require foreign office equipment makers operating in the country to transfer key product technology to China, per Nikkei Asia. In April 2022, Chinese authorities began revamping their national standards to include a new requirement that key components, such as semiconductors and laser-related items, be designed, developed, and pro... » read more

Week In Review: Semiconductor Manufacturing, Test


TSMC is delaying construction on its $40 billion fab in Arizona due to a shortage of U.S. semiconductor workers and higher-than-expected expenses, Bloomberg reported. The Semiconductor Industry Association (SIA) urged the U.S. government to refrain from further restrictions on semiconductor technology to China “until it engages more extensively with industry and experts to assess the impac... » read more

Week In Review: Design, Low Power


Cadence will acquire Rambus' SerDes and memory interface PHY IP business. Rambus will retain its digital IP business, including memory and interface controllers and security IP. “With this transaction, we will increase our focus on market-leading digital IP and chips and expand our roadmap of novel memory solutions to support the continued evolution of the data center and AI,” said Sean Fan... » read more

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