tag: TSVs

Bigger Pipes, New Priorities
By Ed Sperling - 28 Jul, 2011 - Comments: 0

By Ann Steffora Mutschler From the impact of stacking on memory subsystems to advances in computing architecture, Micron Technology is at the forefront in the memory industry. System-Level Design sat down to discuss challenges, as well as some possible solutions, that plague memory subsystem architects with Scott Graham, general manager for Micron’s Hybrid Memory Cube (HMC) and Joe Jeddeloh,... » read more

Experts At The Table: 3D Stacking
By Ed Sperling - 14 Feb, 2011 - Comments: 0

By Ed Sperling Semiconductor Manufacturing and Design sat down with Riko Radojcic, director of engineering at Qualcomm; Drew Wingard, CTO at Sonics; Michael White, senior product marketing manager for Calibre physical verification at Mentor Graphics; Jim Hogan, a Silicon Valley venture capitalist; Prasad Subramaniam, vice president of design technology at eSilicon; and Mike Gianfagna, vice pre... » read more

Deja Vu All Over Again
By Ed Sperling - 27 Jan, 2011 - Comments: 0

Every now and then you get the feeling you’ve been here before, and with technology this is a persistent theme. Virtualization looks remarkably similar to time sharing, which is what most engineers in their 40s and 50s used when they were in college. And 3D stacking, particularly the 2.5D version, looks eerily like the old MCM, aka multi-chip module. There’s nothing wrong with resurre... » read more

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