tag: TU Delft

Connecting Quantum Devices With Sound
By Technical Paper Link - 30 Nov, 2022 - Comments: 0

A new technical paper titled "On-chip distribution of quantum information using traveling phonons" was published by researchers at TU Delft, Center for Nanophotonics, AMOLF, and Eindhoven University of Technology. "Physicists from the Gröblacher lab at TU Delft have built a device that can link different quantum devices and qubits to each other. This device, a silicon chip with vibrations t... » read more

Research Bits: June 8
By Jesse Allen - 08 Jun, 2022 - Comments: 0

Five-second coherence for silicon carbide qubits Researchers from the University of Chicago, National Institutes for Quantum Science and Technology, and Linköping University built a qubit from silicon carbide and was able to retain its coherence, or the length of time the quantum state persists, for over five seconds. “It’s uncommon to have quantum information preserved on these human ... » read more

Technical Paper Round-up: May 31
By Linda Christensen - 31 May, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=30 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for... » read more

Step Towards Quantum Internet: Quantum Teleportation (TU Delft)
By Technical Paper Link - 30 May, 2022 - Comments: 0

New research paper "Qubit teleportation between non-neighbouring nodes in a quantum network" from QuTech and Kavli Institute of Nanoscience, Delft University of Technology, Delft, The Netherlands. Abstract "Future quantum internet applications will derive their power from the ability to share quantum information across the network. Quantum teleportation allows for the reliable transfer of q... » read more

Week In Review: Manufacturing, Test
By Linda Christensen - 06 May, 2022 - Comments: 0

Acquisitions & Investments California-based MaxLinear plans to acquire Taiwan-based Silicon Motion (SMI), in a cash and stock deal valued at about $3.8 billion. Silicon Motion’s NAND flash controller technology for solid state storage devices, will extend MaxLinear’s RF, analog, and mixed signal portfolio. ISMC will invest about $3 billion in a semiconductor plant in India’s south... » read more

Technical Paper Round-up: May 3
By Linda Christensen - 03 May, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=24 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for... » read more

A Case for Transparent Reliability in DRAM Systems
By Technical Paper Link - 29 Apr, 2022 - Comments: 0

New technical paper from ETH Zurich and TU Delft. Abstract "Today's systems have diverse needs that are difficult to address using one-size-fits-all commodity DRAM. Unfortunately, although system designers can theoretically adapt commodity DRAM chips to meet their particular design goals (e.g., by reducing access timings to improve performance, implementing system-level RowHammer mitigati... » read more

New Memories Add New Faults
By Bryon Moyer - 07 Sep, 2021 - Comments: 1

New non-volatile memories (NVM) bring new opportunities for changing how we use memory in systems-on-chip (SoCs), but they also add new challenges for making sure they will work as expected. These new memory types – primarily MRAM and ReRAM – rely on unique physical phenomena for storing data. That means that new test sequences and fault models may be needed before they can be released t... » read more

Startup Funding: May 2021
By Jesse Allen - 02 Jun, 2021 - Comments: 0

Big investment poured into AI hardware companies this month, with a focus on edge applications. Companies are experimenting with different architectures, including analog-focused devices and those that are capable of withstanding the harsh conditions of space. IP and EDA startups in China also drew funding as the country tries to create a full chip design ecosystem. Plus, PCB assembly, photonic... » read more

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