Chip Industry Technical Paper Roundup: Apr. 22


New technical papers recently added to Semiconductor Engineering’s library: [table id=421 /] Find more semiconductor research papers here. » read more

Chip Industry Week In Review


Don't have time to read this? Check out Semiconductor Engineering's Inside Chips podcast.  The U.S. Department of Commerce is investigating TSMC for potential export control violations involving Huawei chips, reports Reuters. The probe follows TechInsights' teardown of a Huawei AI accelerator chip last year. The foundry, meanwhile, maintains it has not shipped any chips to Huawei since 2020... » read more

2D Materials Roadmap: Current And Future Challenges, Solutions


A new technical paper titled "The 2D Materials Roadmap" was published by researchers at many institutions including Chinese Academy of Sciences, TU Denmark, Pennsylvania State University, University of Manchester, University of Cambridge et al. Abstract "Over the past two decades, 2D materials have rapidly evolved into a diverse and expanding family of material platforms. Many members of th... » read more

Technical Paper Roundup: Sept 11


New technical papers added to Semiconductor Engineering’s library this week. [table id=136 /] (more…) » read more

Automotive Intrusion Detection Methodologies (TU Denmark)


A new technical paper titled "Intrusion Detection in the Automotive Domain: A Comprehensive Review" was published by researchers at DTU Compute Technical University of Denmark Abstract "The automotive domain has realized amazing advancements in communication, connectivity, and automation— and at a breakneck pace. Such advancements come with ample benefits, such as the reduction of traffic... » read more