NIST EUV report; automotive intrusion detection; computing on data stored in DNA; graphene transistor for biosensing; shallow dynamic circuits for long-range entanglement; new layered structure with 2D; CXL’s memory protection; eco-friendly conductive ink for soft electronics.
New technical papers added to Semiconductor Engineering’s library this week.
| Technical Paper | Research Organizations |
|---|---|
| Report from the Extreme Ultraviolet (EUV) Lithography Working Group Meeting: Current State, Needs, and Path Forwards | National Institute of Standards and Technology (NIST) |
| Intrusion Detection in the Automotive Domain: A Comprehensive Review | DTU Compute Technical University of Denmark |
| Neural network execution using nicked DNA and microfluidics | University of Minnesota Twin-Cities and Rochester Institute of Technology |
| Wafer-Scale Graphene Field-Effect Transistor Biosensor Arrays with Monolithic CMOS Readout | VTT Technical Research Centre of Finland and Graphenea Semiconductor SLU |
| Efficient Long-Range Entanglement using Dynamic Circuits | IBM Research, IBM T.J. Watson Research Center, University of Southern California, MIT-IBM Watson AI Lab, and IBM Quantum |
| Excitation-Dependent High-Lying Excitonic Exchange via Interlayer Energy Transfer from Lower-to-Higher Bandgap 2D Material | University of Warsaw, Brookhaven National Laboratory, and National Institute for Materials Science (Japan) |
| How Flexible is CXL’s Memory Protection?: Replacing a sledgehammer with a scalpel | University of Cambridge |
| Recyclable Thin-Film Soft Electronics for Smart Packaging and E-Skins | Carnegie Mellon University and University of Coimbra |
More Reading
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