Technical Paper Roundup: Sept 11

NIST EUV report; automotive intrusion detection; computing on data stored in DNA; graphene transistor for biosensing; shallow dynamic circuits for long-range entanglement; new layered structure with 2D; CXL’s memory protection; eco-friendly conductive ink for soft electronics.


New technical papers added to Semiconductor Engineering’s library this week.

Technical Paper Research Organizations
Report from the Extreme Ultraviolet (EUV) Lithography Working Group Meeting: Current State, Needs, and Path Forwards National Institute of Standards and Technology (NIST)
Intrusion Detection in the Automotive Domain: A Comprehensive Review DTU Compute Technical University of Denmark
Neural network execution using nicked DNA and microfluidics University of Minnesota Twin-Cities and Rochester Institute of Technology
Wafer-Scale Graphene Field-Effect Transistor Biosensor Arrays with Monolithic CMOS Readout VTT Technical Research Centre of Finland and Graphenea Semiconductor SLU
Efficient Long-Range Entanglement using Dynamic Circuits IBM Research, IBM T.J. Watson Research Center, University of Southern California, MIT-IBM Watson AI Lab, and IBM Quantum
Excitation-Dependent High-Lying Excitonic Exchange via Interlayer Energy Transfer from Lower-to-Higher Bandgap 2D Material University of Warsaw, Brookhaven National Laboratory, and National Institute for Materials Science (Japan)
How Flexible is CXL’s Memory Protection?: Replacing a sledgehammer with a scalpel University of Cambridge
Recyclable Thin-Film Soft Electronics for Smart Packaging and E-Skins Carnegie Mellon University and University of Coimbra

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