tag: Rochester Institute of Technology

Chip Industry Technical Paper Roundup: June 10
By Linda Christensen - 10 Jun, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=232 /] More ReadingTechnical Paper Library home » read more

Comparing Thermal Properties In Molybdenum Substrate To Si And Glass For A System-On-Foil Integration (RIT, Lux)
By Technical Paper Link - 31 May, 2024 - Comments: 0

A technical paper titled “Comparative Analysis of Thermal Properties in Molybdenum Substrate to Silicon and Glass for a System-on-Foil Integration” was published by researchers at Rochester Institute of Technology and Lux Semiconductors. Abstract: "Advanced electronics technology is moving towards smaller footprints and higher computational power. In order to achieve this, advanced packag... » read more

Chip Industry Week In Review
By The SE Staff - 02 Feb, 2024 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan. Cadence introduced an AI-based thermal stress and analysis platform aimed at 2.5D and 3D-ICs, and cooling for PCBs and electronic assemblies. The company also debuted a HW/SW accelerated digital twin solution for multi-physics system design and analysis, combining GPU-resident computational fluid dynamics (CFD) solvers with dedicated GPU hardwar... » read more

Money Pours Into New Fabs And Facilities
By Liz Allan - 03 Jan, 2024 - Comments: 0

Fabs, packaging, test and assembly, and R&D all drew major funding in 2023. Companies poured money into offshore locations, such as India and Malaysia, to access a larger workforce and lower costs, while also partnering with governments to secure domestic supply chains amid ongoing geopolitical turmoil. Looking ahead, artificial intelligence (AI), quantum computing, and data applications... » read more

Chip Industry Week In Review
By The SE Staff - 08 Dec, 2023 - Comments: 0

By Jesse Allen, Karen Heyman, and Liz Allan AMD took the covers off new AI accelerators for training and inferencing of large language model and high-performance computing workloads. In its announcement, AMD focused heavily on performance leadership in the commercial AI processor space through a combination of architectural changes, better software efficiency, along with some improvements in... » read more

Chip Industry’s Technical Paper Roundup: October 24
By Liz Allan - 24 Oct, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=157 /] More Reading Technical Paper Library home » read more

Scalable And Compact Multi-Bit CAM Designs Using FeFETs
By Technical Paper Link - 16 Oct, 2023 - Comments: 0

A technical paper titled “SEE-MCAM: Scalable Multi-bit FeFET Content Addressable Memories for Energy Efficient Associative Search” was published by researchers at Zhejiang University, China, Georgia Institute of Technology, University of California Irvine, Rochester Institute of Technology, University of Notre Dame, and Laboratory of Collaborative Sensing and Autonomous Unmanned Systems of ... » read more

Chip Industry Talent Shortage Drives Academic Partnerships
By Liz Allan - 16 Oct, 2023 - Comments: 0

Universities around the world are forming partnerships with semiconductor companies and governments to help fill open and future positions, to keep curricula current and relevant, and to update and expand skills for working engineers. Talent shortages repeatedly have been cited as the number one challenge for the chip industry. Behind those concerns are several key drivers, and many more dom... » read more

Ferroelectric Memories Answer Call For Non-Volatile Alternatives
By Katherine Derbyshire - 21 Sep, 2023 - Comments: 0

As system designers seek to manipulate larger data sets while reducing power consumption, ferroelectric memory may be part of the solution. It offers an intermediate step between the speed of DRAM and the stability of flash memory. Changing the polarization of ferroelectric domains is extremely fast, and the polarization remains stable without power for years, if not decades. FeFETs, one of ... » read more

Technical Paper Roundup: Sept 11
By Liz Allan - 11 Sep, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=136 /] (more…) » read more

← Older posts

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy