tag: National Institute of Standards and Technology

Chip Industry Technical Paper Roundup: July 8
By Linda Christensen - 08 Jul, 2026 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations Effect of Exchange-Correlation Functionals on Schottky Barriers at Si/Metal Interfaces NIST, University of Maryland, Johns Hopkins University AgRefactor: Self-Evolving Agentic Workflow for HLS Compatibility and Performance Carnegie Mellon University, UCLA ... » read more

Computational Strategies for Schottky Barrier Heights Prediction (NIST, U. Maryland, Johns Hopkins)
By Technical Paper Link - 03 Jul, 2026 - Comments: 0

Researchers from NIST, University of Maryland, and Johns Hopkins University published a technical paper titled “Effect of Exchange-Correlation Functionals on Schottky Barriers at Si/Metal Interfaces.” Abstract excerpt "Accurate prediction of Schottky barrier heights (SBHs) at metal–semiconductor interfaces is essential for understanding and optimizing charge injection in electronic and ... » read more

Research Bits: June 8
By Jesse Allen - 08 Jun, 2026 - Comments: 0

Multi-tasking transistor Researchers at Pohang University of Science & Technology (POSTECH) developed a zinc oxide (ZnO) and tellurium (Te) heterojunction transistor technology that exhibits negative differential transconductance (NDT), where current decreases over a certain voltage range. By precisely controlling overlap length between the two materials, the team realized double negati... » read more

Research Bits: Mar. 31
By Jesse Allen - 31 Mar, 2026 - Comments: 0

2D hard mask material Researchers from Penn State University and University of Chemistry and Technology Prague propose using the 2D material chromium oxychloride (CrOCl) as a hard mask, because its layered structure is resistant to plasma etching and enables it to be an effective mask at smaller thicknesses. “This 2D material is like lasagna. It’s a layer-by-layer structure,” said Zih... » read more

Chip Industry Technical Paper Roundup: Dec 30
By Emma Riverso - 30 Dec, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=509 /] Find more semiconductor research papers here. » read more

CHIPS For America’s National Semiconductor Technology Center (NSTC) Program
By Barry Pangrle - 03 Jul, 2024 - Comments: 0

At this year’s Design Automation Conference, Jay Lewis, director of CHIPS for America National Semiconductor Technology Center (NSTC) Program, gave a presentation on the status and direction of the Center, its priorities for this year and how the NSTC can change the long-term trajectory for innovation. Fig. 1: Dr. Jay Lewis, director of NSTC Program, CHIPS R&D Office at the Dept. o... » read more

Metrology For 2D Materials: A Review From The International Roadmap For Devices And Systems (NIST, Et Al.)
By Technical Paper Link - 30 Apr, 2024 - Comments: 0

A technical paper titled “Metrology for 2D materials: a perspective review from the international roadmap for devices and systems” was published by researchers at Arizona State University, IBM Research, Unity-SC, and the National Institute of Standards and Technology (NIST). Abstract: "The International Roadmap for Devices and Systems (IRDS) predicts the integration of 2D materials into h... » read more

Research Bits: Feb. 13
By Jesse Allen - 13 Feb, 2024 - Comments: 0

Fast phase-change memory Researchers from Stanford University, TSMC, National Institute of Standards and Technology (NIST), and University of Maryland developed a new phase-change memory for future AI and data-centric systems. It is based on GST467, an alloy of four parts germanium, six parts antimony, and seven parts tellurium, which is sandwiched between several other nanometer-thin material... » read more

A New Phase-Change Memory For Processing Large Amounts Of Data 
By Technical Paper Link - 30 Jan, 2024 - Comments: 0

A technical paper titled “Novel nanocomposite-superlattices for low energy and high stability nanoscale phase-change memory” was published by researchers at Stanford University, TSMC, NIST, University of Maryland, Theiss Research and Tianjin University. Abstract: "Data-centric applications are pushing the limits of energy-efficiency in today’s computing systems, including those based on... » read more

An Overview Of Federal Government Semiconductors And Microelectronics Standards Activities (NIST)
By Technical Paper Link - 12 Jan, 2024 - Comments: 0

A technical paper titled “Semiconductors and Microelectronics Standards, Report of the Semiconductors and Microelectronics Working Group” was published by researchers at the National Institute of Standards and Technology (NIST). Abstract: "This report of the Semiconductors and Microelectronics Working Group of the Interagency Committee on Standards Policy (ICSP) provides an overview of Fe... » read more

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