Chip Industry Technical Paper Roundup: Jan. 16


New technical papers added to Semiconductor Engineering’s library this week. [table id=188 /] More ReadingTechnical Paper Library home » read more

Demonstrating A 2D–0D Hybrid Optical Multi-Level Memory Device Operated By Laser Pulses


A technical paper titled “Probing Optical Multi-Level Memory Effects in Single Core–Shell Quantum Dots and Application Through 2D-0D Hybrid Inverters” was published by researchers at Korea Institute of Science and Technology (KIST), Korea University, Daegu Gyeongbuk Institute of Science and Technology (DGIST), National Institute for Materials Science (Japan), and University of Science and... » read more

Chip Industry Technical Paper Roundup: Dec 18


New technical papers added to Semiconductor Engineering’s library this week. [table id=176 /] More ReadingTechnical Paper Library home » read more

Research Bits: Dec. 18


Stacking 2D layers for AI processing Researchers from Washington University in St. Louis, MIT, Yonsei University, Inha University, Georgia Institute of Technology, and the University of Notre Dame demonstrated monolithic 3D integration of layered 2D material, creating a novel AI processing hardware that integrates sensing, signal processing, and AI computing functions into a single chip. Th... » read more

A Polymer-Free Technique For Assembling Van Der Waals Heterostructures Using Flexible Si Nitride Membranes


A technical paper titled “Clean assembly of van der Waals heterostructures using silicon nitride membranes” was published by researchers at University of Manchester, Imperial College London, National Institute for Materials Science (Japan), and University of Lancaster. Abstract Van der Waals heterostructures are fabricated by layer-by-layer assembly of individual two-dimensional mater... » read more

Neuromorphic Devices Based On Memristive Nanowire Networks


A technical paper titled “Online dynamical learning and sequence memory with neuromorphic nanowire networks” was published by researchers at University of Sydney, University of California Los Angeles (UCLA), National Institute for Materials Science (NIMS), Kyushu Institute of Technology (Kyutech), and University of Sydney Nano Institute. Abstract: "Nanowire Networks (NWNs) belong to an em... » read more

Technical Paper Roundup: Sept 11


New technical papers added to Semiconductor Engineering’s library this week. [table id=136 /] (more…) » read more

A New Layered Structure With 2D Material That Exhibits A Unique Transfer Of Energy And Charge


A technical paper titled “Excitation-Dependent High-Lying Excitonic Exchange via Interlayer Energy Transfer from Lower-to-Higher Bandgap 2D Material” was published by researchers at University of Warsaw, Brookhaven National Laboratory, and National Institute for Materials Science (Japan). Abstract: "High light absorption (∼15%) and strong photoluminescence (PL) emission in monolayer (1L... » read more

Research Bits: September 5


Layered TMD semiconductors Scientists from Tsinghua University investigated fabrication techniques for fabricating and engineering transition metal dichalcogenides (TMDs). By modulating TMDs with various methods, including phase engineering, defect engineering, doping, and alloying, the material class could provide a wide range of alternatives for high-quality layered semiconductors with st... » read more

Chip Industry’s Technical Paper Roundup: July 18


New technical papers recently added to Semiconductor Engineering’s library: [table id=118 /] (more…) » read more

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