Research Bits: Aug. 13


3D X-ray of chip interiors Researchers from the Paul Scherrer Institute, EPFL Lausanne, ETH Zurich, and the University of Southern California used X-rays to take non-destructive, three-dimensional images of the inside of a microchip at 4 nanometer resolution. To create the images, the researchers relied on a technique called ptychography, in which a computer combines many individual images ... » read more

Research Bits: December 5


Neuromorphic nanowires Researchers from UCLA and University of Sydney built an experimental computing system physically modeled after the biological brain. The device is composed of a tangled-up network of wires containing silver and selenium that were allowed to self-organize into a network of entangled nanowires on top of an array of 16 electrodes. The nanowire network physically reconfigure... » read more

The Week In Review: Semiconductors


The tech-centric NASDAQ index this week broke 9,000, which was a first. Key to the latest run-up were reports of a breakthrough on the trade war with China and continued low interest rates. Chuck Peddle, who helped democratize computing and fuel Moore's Law with his $25 processor chip, passed away last week. Peddle designed the MOS Technology 6502, which was the basis for the KIM-1 single-bo... » read more

Power/Performance Bits: Sept. 11


Thread transistor Researchers at Tufts University developed a thread-based transistor that can be fashioned into simple, all-thread based logic circuits and integrated circuits which could be woven into fabric or worn on the skin, or even surgically implanted. The thread-based transistor (TBT) is made of a linen thread coated with carbon nanotubes, creating a semiconductor surface. Two thin... » read more

The Week In Review: Manufacturing


Chipmakers UMC has appointed two senior vice presidents--S.C. Chien and Jason Wang--as co-presidents of the company, following Po-Wen Yen’s retirement as UMC’s CEO. The co-presidents are accountable for the overall performance of UMC. They will report to UMC Chairman Stan Hung. Chien will focus on the core manufacturing and technology aspects of UMC, including R&D and operations. Wang wil... » read more

System Bits: July 19


Using carbon nanotubes to leapfrog today’s silicon chips According to Stanford University’s Subhasish Mitra, associate professor of electrical engineering and of computer science, and H.-S. Philip Wong, professor of electrical engineering, the future of supercomputing might actually be really, really small. With support from the National Science Foundation, the two are working with IBM and... » read more

3D Construction Ahead


One of the interesting features of Photonics West is that it covers the full spectrum, from academic research to industrial research to new products in the commercial exhibits. This range of interrelated ideas was on show in 3D fabrication. At one extreme, the latest research in scanning multi-spot three-photon patterning showed 3D structures 100μm thick with 50nm features. Researchers als... » read more