tag: U.S. Department of Energy

Manufacturing Bits: March 30
By Mark LaPedus - 30 Mar, 2021 - Comments: 0

Open access quantum computing Sandia National Laboratories has begun offering an open access program for its quantum computing testbed. Sandia will enable researchers to explore a range of new technologies, such as chemistry, materials science and mathematics, using its so-called Quantum Scientific Computing Open User Testbed (QSCOUT). Quantum computers promise to solve problems that are to... » read more

Week In Review: Design, Low Power
By Jesse Allen - 29 Jan, 2021 - Comments: 0

The CXL Consortium published the Compute Express Link 2.0 specification. CXL is an interconnect that maintains memory coherency between the CPU memory space and memory on attached devices. CXL 2.0 adds support for switching for fan-out to connect to more devices, memory pooling for increased memory utilization efficiency and providing memory capacity on demand, and support for persistent memory... » read more

Manufacturing Bits: Jan. 5
By Mark LaPedus - 05 Jan, 2021 - Comments: 0

Gallium oxide chips The National Renewable Energy Laboratory (NREL), the Colorado School of Mines, and Saint-Gobain Crystals have teamed up to develop manufacturing technologies and devices based on an emerging material called gallium oxide. This work is part of a three-year program, dubbed the Oxide Electronic Devices for Extreme Operating Environments project, which is funded by the U.S. ... » read more

Manufacturing Bits: Dec. 7
By Mark LaPedus - 07 Dec, 2020 - Comments: 0

Cybersecurity for manufacturing The University of Texas at San Antonio (UTSA) has launched a center to address cybersecurity issues in the U.S. manufacturing sector. The center, called the Cybersecurity Manufacturing Innovation Institute (CyManII), is a $111 million public-private partnership. As part of the effort, UTSA will enter into a five-year corporative agreement with the U.S. Depart... » read more

Manufacturing Bits: Feb. 18
By Mark LaPedus - 18 Feb, 2020 - Comments: 0

Molecular layer etch The U.S. Department of Energy’s Argonne National Laboratory has made new advances in the field of molecular layer etching or etch (MLE). MLE is related to atomic layer etch (ALE). Used in the semiconductor industry, ALE selectively removes targeted materials at the atomic scale without damaging other parts of the structure. ALE is related to atomic layer deposition... » read more

Manufacturing Bits: Feb. 10
By Mark LaPedus - 10 Feb, 2020 - Comments: 0

Accelerating and cooling muons Using a novel particle accelerator, a group for the first time have observed a phenomenon called muon ionization cooling–an event that could give researchers a better understanding of matter and the universe. Muons are obscure sub-atomic particles. This experiment could pave the way towards the development of new and powerful muon particle accelerators. Thes... » read more

Manufacturing Bits: Oct. 15
By Mark LaPedus - 15 Oct, 2019 - Comments: 0

Sandia’s fab upgrade Sandia National Laboratories has completed the first phase of a three-year upgrade program in its semiconductor wafer fab. The goal of the program is to convert Sandia’s Albuquerque, N.M.-based fab from 150mm (6-inch) to 200mm (8-inch) wafer sizes. As part of the move, Sandia is converting its 0.35-micron (350nm) rad-hard process from 150mm to 200mm. The process is ... » read more

Manufacturing Bits: Sept. 24
By Mark LaPedus - 24 Sep, 2019 - Comments: 0

Free flow electricity Researchers have made some new breakthroughs in the emerging field of Weyl fermions and semi-metals, a move that could one day enable free flow electricity in systems. In 2015, Princeton University and others finally proved a massless particle that had been theorized for 85 years--the Weyl fermion. A fermion is a subatomic particle. Proposed by the mathematician and... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 13 Sep, 2019 - Comments: 0

Chipmakers and OEMs Delphi Technologies is in volume production with a 800 volt silicon carbide (SiC) inverter for next-generation electric and hybrid vehicles. The inverter extends electric vehicle (EV) ranges. It also halves the charging times compared with today's 400 volt systems. In a separate announcement, Delphi Technologies and Cree have announce a partnership to utilize SiC semicon... » read more

Manufacturing Bits: July 10
By Mark LaPedus - 10 Jul, 2019 - Comments: 0

Semicon West It’s Semicon West time again. Here’s the first wave of announcements at the event: Applied Materials has unveiled a pair of tools aimed at accelerating the industry adoption for new memories. First, Applied rolled out the Endura Clover MRAM PVD system. The system is an integrated platform for MRAM devices. Second, the company introduced the Endura Impulse PVD platform for P... » read more

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