System Bits: Feb. 2

By Ann Mutschler - 02 Feb, 2016 - Comments: 0

Wearable sensors reveal health data from sweat In the name of science, UC Berkeley researchers want you to break out into a sweat — so it can be analyzed, of course. Specifically, the researchers have created a flexible sensor system that can measure metabolites and electrolytes in sweat, calibrate the data based upon skin temperature and sync the results in real time to a smartphone. The... » read more

System Bits: Jan. 26

By Ann Mutschler - 26 Jan, 2016 - Comments: 0

Precisely controlling graphene molecules Researchers at UCLA’s California NanoSystems Institute have found that in the same way gardeners may use sheets of plastic with strategically placed holes to allow plants to grow but keep weeds from taking root, the same basic approach can be applied in terms of placing molecules in the specific patterns they need within tiny nanoelectronic devices, w... » read more

System Bits: Dec. 29

By Ann Mutschler - 29 Dec, 2015 - Comments: 0

Optoelectronics built using existing manufacturing Using only processes found in existing microchip fabrication facilities, researchers at MIT, the University of California at Berkeley, and the University of Colorado have produced a working optoelectronic microprocessor that computes electronically but uses light to move information. The researchers reminded that optical communications prom... » read more

System Bits: Dec. 15

By Ann Mutschler - 15 Dec, 2015 - Comments: 0

Building chips skyscraper style With the aim of boosting electronic performance by factor of a thousand, a team of researchers led by Stanford University engineers have created a skyscraper-like chip design, based on materials more advanced than silicon. For many years, computer systems have been designed with processors and memory chips laid out like single-story structures in a suburb whe... » read more

MEMS: Flexible, Reusable Platforms Facilitate Innovation

By Paula Doe - 07 Dec, 2015 - Comments: 0

As the game-changing enabler for whatever the emerging market of widespread fragmented intelligence turns out to look like, the MEMS sector is in some ways the bellwether for much of the greater semiconductor/components supply chain looking to rethink how to serve a wider range of fragmented applications with lower costs and faster time to market. Leaders from Cisco, InvenSense, Nasiri Ventures... » read more

Power/Performance Bits: Dec. 1

By Jesse Allen - 01 Dec, 2015 - Comments: 0

Hiding wires from the sun There's a problem with most solar cells: the electricity-carrying metal wire grid on top prevents sunlight from reaching the semiconductor below. A team from Stanford University tackled this problem, discovering a way to hide the reflective upper contact and funnel light directly to the semiconductor below. For the study, the researchers placed a 16-nanometer-thi... » read more

Power/Performance Bits: Aug. 11

By Jesse Allen - 11 Aug, 2015 - Comments: 0

Tilting magnets for memory UC Berkeley researchers discovered a new way to switch the polarization of nanomagnets, which may offer a way for high-density storage to move from hard disks onto integrated circuits and potentially open the door to a memory system that can be packed onto a microprocessor. Creating and switching polarity in magnets without an external magnetic field has been a ... » read more

Manufacturing Bits: August 4

By Mark LaPedus - 04 Aug, 2015 - Comments: 0

Diamond metrology The U.S. Department of Energy’s Ames Laboratory is building a new instrument called an optical magnetometer. The system will help researchers understand the properties of new magnetic nanomaterials. The system, dubbed the NV-magnetoscope, makes use of the properties of nitrogen-vacancy (NV) centers in diamonds. According to researchers, diamonds have a flaw, or imperfect... » read more

The Future Of Moore’s Law

By Ed Sperling - 03 Aug, 2015 - Comments: 0

Semiconductor Engineering sat down to discuss the future of Moore's Law with Jan Rabaey, Donald O. Pederson distinguished professor at [getentity id="22165" comment="UC Berkeley"]; Lucio Lanza, managing director of Lanza techVentures; Subramani Kengeri, vice president of advanced technology architecture at [getentity id="22819" comment="GlobalFoundries"]; Charlie Cheng, CEO of [getentity id="2... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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