System Bits: March 17

By Ann Mutschler - 17 Mar, 2015 - Comments: 0

Symmetry in graphene growth According to Rice University researchers, what lies beneath growing islands of graphene is important to its properties. The team analyzed patterns of graphene – a single-atom-thick sheet of carbon – grown in a furnace via chemical vapor deposition and discovered that the geometric relationship between graphene and the substrate, the underlying material on whi... » read more

Rethinking The Cloud

By Ed Sperling - 12 Mar, 2015 - Comments: 0

Data center architectures have seen very few radical changes since the commercial introduction of the [getentity id="22306" comment="IBM"] System/360 mainframe in 1964. There have been incremental improvements in speed and throughput over the years, with a move to a client/server model in the 1990s, but from a high level this is still an environment where data is processed and stored centrally ... » read more

Manufacturing Bits: March 10

By Mark LaPedus - 10 Mar, 2015 - Comments: 0

Hi-tech pens The University of California at San Diego has developed a hi-tech ballpoint pen. Researchers have taken off-the-shelf ballpoint pens and filled them with bio inks. With so-called enzymatic-ink-based roller pens, users are able to draw biocatalytic sensors on a surface. [caption id="attachment_18297" align="alignleft" width="300"] Researchers draw sensors capable of detecting... » read more

System Bits: Feb. 3

By Ann Mutschler - 03 Feb, 2015 - Comments: 0

A viable silicon substitute A new study by UC Berkeley, the University of Pennsylvania and the University of Illinois at Urbana-Champaign (UIUC) moves graphene a step closer to knocking silicon off as the dominant workhorse of the electronics industry. They reminded that while silicon is ubiquitous in semiconductors and integrated circuits, researchers have been eyeing graphene, a one-atom... » read more

Power/Performance Bits: Dec. 23

By Ann Mutschler - 23 Dec, 2014 - Comments: 0

Glimpsing pathway of sunlight to electricity According to University of Oregon and Lund University researchers, four pulses of laser light on nanoparticle photocells in a University of Oregon spectroscopy experiment have opened a window on how captured sunlight can be converted into electricity. The work, which the researchers expect could inspire devices with improved efficiency in solar e... » read more

Power/Performance Bits: Dec. 16

By Ann Mutschler - 16 Dec, 2014 - Comments: 0

Measuring electrons in silicon In what is believed to be a first, a team of physicists and chemists based at UC Berkeley, Ludwig-Maximilians Universität in Munich, Germany, the University of Tsukuba, Japan, and the Molecular Foundry at the Department of Energy’s Lawrence Berkeley National Laboratory has captured images of electrons breaking free of their atomic shells using attosecond pulse... » read more

System Bits: Dec. 16

By Ann Mutschler - 16 Dec, 2014 - Comments: 0

High rise chip For decades, the mantra of the semiconductor industry has been ‘smaller, faster, cheaper.’ Stanford researchers are also adding ‘taller’ to the mix, and describing how to build high-rise chips that promise to leapfrog the performance of the single-story logic and memory chips on today's circuit cards. Stanford researchers said their approach would end the ‘logjams�... » read more

Smarter Cars, But How Smart?

By Ernest Worthman - 09 Dec, 2014 - Comments: 0

With the emergence of the Internet of Things, smart cars are beginning to garner more attention — the kind that comes with real R&D dollars, market development plans and cost analyses for future commercialization. Smart cars are different than connected cars, which are simply smartphones on wheels. Until now, the focus on intelligence in automobiles has largely been on driver assist and in... » read more

Power/Performance Bits: Oct. 28

By Ann Mutschler - 28 Oct, 2014 - Comments: 0

More powerful, sensitive wearables With their special electronic and optical properties, nanomaterials such as graphene and molybdenum sulfide have created excitement among UCLA scientists for their potential to revolutionize transistors and circuits. Research is underway there that has the potential to increase the efficiency and capabilities of the 2D layered semiconductors used in high-s... » read more

IoT Standards Needed

By Ed Sperling - 02 Oct, 2014 - Comments: 0

The promise of the [getkc id="76" comment="Internet of Things"] is effortless communication between devices, all of which are smart enough to transmit data to the Internet directly, or through connecting hubs, and to ad hoc devices that are authorized to be added to a personal or industrial network. What's not yet clear is how that promise will be realized. Even though many devices are desig... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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