Framework To Compile Quantum Programs Onto Chiplets (UCSB, Cisco)


A technical paper titled "Compilation for Quantum Computing on Chiplets" was published by researchers at UC Santa Barbara and Cisco Quantum Lab. Abstract: "Chiplet architecture is an emerging architecture for quantum computing that could significantly increase qubit resources with its great scalability and modularity. However, as the computing scale increases, communication between qubits w... » read more

Chip Industry’s Technical Paper Roundup: May 23


New technical papers recently added to Semiconductor Engineering’s library: [table id=104 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us... » read more

Impact of Semiconductor Optical Amplifers On Performance & Power Consumption in Data Centers (UCSB)


A new technical paper titled "Integrated SOAs enable energy-efficient intra-data center coherent links" was published by researchers at UC Santa Barbara. "In this work, we analyze the impact of integrated semiconductor optical amplifiers (SOAs) on link performance and power consumption, and describe the optimal design spaces for low-cost and energy-efficient coherent links. Placing SOAs afte... » read more

Chip Industry’s Technical Paper Roundup: Dec. 20


New technical papers added to Semiconductor Engineering’s library this week. [table id=71 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us po... » read more

GaN ICs Wanted for Power, EV Markets


Circuits built with discrete GaN components may get the job done, but fully integrated GaN circuits remain the ultimate goal because they would offer many of the same advantages as integrated silicon circuits. These benefits include lower cost as the circuit footprint is scaled, and reduced parasitic resistance and capacitance with shorter interconnect runs. In addition, improved device perf... » read more

The Chip Industry’s Next-Gen Roadmap


Todd Younkin, the new president and chief executive of the Semiconductor Research Corp. (SRC), sat down with Semiconductor Engineering to talk about engineering careers, R&D trends and what’s ahead for chip technologies over the next decade. What follows are excerpts of that conversation. SE: As a U.S.-based chip consortium, what is SRC's charter? Younkin: The Semiconductor Research... » read more

Revving Up For Edge Computing


The edge is beginning to take shape as a way of limiting the amount of data that needs to be pushed up to the cloud for processing, setting the stage for a massive shift in compute architectures and a race among chipmakers for a stake in a new and highly lucrative market. So far, it's not clear which architectures will win, or how and where data will be partitioned between what needs to be p... » read more

System Bits: Oct. 23


Adapting machine learning for use in scientific research To better tailor machine learning for effective use in scientific research, the U.S. Department of Energy has awarded a collaborative grant to a group of researchers, including UC Santa Barbara mathematician Paul Atzberger, to establish a new data science research center. According to UCSB, the Physics-Informed Learning Machines for M... » read more

System Bits: Oct. 9


Sensing with light pulses In a development expected to be useful in applications including distance measurement, molecular fingerprinting and ultrafast sampling, EPFL researchers have found a way to implement an optical sensing system by using spatial multiplexing, a technique originally developed in optical-fiber communication, which produces three independent streams of ultrashort optical pu... » read more

The Growing Materials Challenge


By Katherine Derbyshire & Ed Sperling Materials have emerged as a growing challenge across the semiconductor supply chain, as chips continue to scale, or as they are utilized in new devices such as sensors for AI or machine learning systems. Engineered materials are no longer optional at advanced nodes. They are now a requirement, and the amount of new material content in chips contin... » read more

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