tag: UCLA

Power/Performance Bits: June 23
By Jesse Allen - 23 Jun, 2020 - Comments: 0

Capturing waste heat Researchers at Wuhan University and University of California Los Angeles developed a hydrogel that can both cool down electronics and convert the waste heat into electricity. The thermogalvanic hydrogel consists of a polyacrylamide framework infused with water and specific ions. When they heated the hydrogel, two of the ions (ferricyanide and ferrocyanide) transferred e... » read more

Manufacturing Bits: Nov. 25
By Mark LaPedus - 25 Nov, 2019 - Comments: 0

RF carbon nanotubes For years, the industry has been working on logic and memory devices based on carbon nanotubes, although these technologies remain in R&D. Now, there is a new device type using carbon nanotubes--RF. Startup Carbonics has developed an RF-based carbon nanotube technology that operates at frequencies over 100GHz. The technology exceeds the cutoff frequency of today�... » read more

Manufacturing Bits: Oct. 9
By Mark LaPedus - 09 Oct, 2019 - Comments: 0

World’s strongest silver A group has developed what researchers say is the world’s strongest silver. The silver demonstrated a hardness of 3.05 GPa, which is 42% stronger than the previous world record. The University of Vermont, Lawrence Livermore National Lab, the Ames Laboratory, Los Alamos National Laboratory and UCLA contributed to the work. Silver is an element with high electr... » read more

Power/Performance Bits: Oct. 1
By Jesse Allen - 01 Oct, 2019 - Comments: 0

Nighttime power Researchers at UCLA and Stanford University created a low-cost device that harnesses radiative cooling to provide a small amount of renewable energy at night. While the device only provides a small amount of power, it could be useful for areas without reliable electricity or access to batteries. Radiative cooling happens when a surface that faces the sky emits heat as therma... » read more

The Race To Next-Gen 2.5D/3D Packages
By Mark LaPedus - 23 Sep, 2019 - Comments: 4

Several companies are racing each other to develop a new class of 2.5D and 3D packages based on various next-generation interconnect technologies. Intel, TSMC and others are exploring or developing future packages based on one emerging interconnect scheme, called copper-to-copper hybrid bonding. This technology provides a way to stack advanced dies using copper connections at the chip level,... » read more

Manufacturing Bits: June 18
By Mark LaPedus - 18 Jun, 2019 - Comments: 0

Making microvias in packages At the recent IEEE Electronic Components and Technology Conference (ECTC) in Las Vegas, Georgia Institute of Technology, Tokyo Ohka Kogyo (TOK) and Panasonic presented a paper on a technology that enables ultra-small microvias for advanced IC packages. Researchers demonstrated a picosecond UV laser technology as well as materials, which enabled 2μm to 7μm vias... » read more

Power/Performance Bits: May 6
By Jesse Allen - 06 May, 2019 - Comments: 0

Compressing objects Computer scientists at MIT propose a way to improve data compression in memory by focusing on objects rather than cache lines. "The motivation was trying to come up with a new memory hierarchy that could do object-based compression, instead of cache-line compression, because that's how most modern programming languages manage data," said Po-An Tsai, a graduate student at... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 08 Mar, 2019 - Comments: 0

Internet of Things Dialog Semiconductor is shifting its product portfolio away from smartphones following its pending $600 million deal with Apple. The chip company is looking toward connected-health products and video-game consoles for future growth. The connected-health devices, developed in collaboration with pharmaceutical firms, would monitor blood pressure and check glucose levels, accor... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 08 Feb, 2019 - Comments: 0

Internet of Things McKinsey & Company identified 10 top trends in the Internet of Things. They include: IoT is a business opportunity, not just a tech opportunity; disciplined execution across multiple use cases is the path to value; and IoT is gradually enabling more subscription business models, but consumers are resistant. Louis Columbus of IQMS provides some IoT data points and id... » read more

Power/Performance Bits: Jan. 29
By Jesse Allen - 29 Jan, 2019 - Comments: 0

Neural nets struggle with shape Cognitive psychologists at the University of California Los Angeles investigated how deep convolutional neural networks identify objects and found a big difference between the way these networks and humans perceive objects. In the first of a series of experiments, the researchers showed color images of animals and objects that had been altered to have a diffe... » read more

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