tag: UCLA

Power/Performance Bits: March 16
By Jesse Allen - 16 Mar, 2021 - Comments: 0

Adaptable neural nets Neural networks go through two phases: training, when weights are set based on a dataset, and inference, when new information is assessed based on those weights. But researchers at MIT, Institute of Science and Technology Austria, and Vienna University of Technology propose a new type of neural network that can learn during inference and adjust its underlying equations to... » read more

Power/Performance Bits: Jan. 19
By Jesse Allen - 19 Jan, 2021 - Comments: 0

Electronic skin for health tracking Researchers at the University of Colorado Boulder developed a stretchy electronic 'skin' that can perform the tasks of wearable fitness devices such as tracking body temperature, heart rate, and movement patterns. "Smart watches are functionally nice, but they're always a big chunk of metal on a band," said Wei Zhang, a professor in the Department of Chem... » read more

Power/Performance Bits: Oct. 20
By Jesse Allen - 20 Oct, 2020 - Comments: 0

Benchmarking quantum layout synthesis Computer scientists at the University of California Los Angeles found that current compilers for quantum computers are inhibiting optimal performance and argue that better quantum compilation design could help improve computation speeds up to 45 times. The team designed a family of benchmark quantum circuits with known optimal depths or sizes, which cou... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 02 Jul, 2020 - Comments: 0

The American Foundries Act, a bipartisan initiative to revive U.S. leadership in the global microelectronics sector, was announced by U.S. Democratic Senator Chuck Schumer from New York. “The economic and national security risks posed by relying too heavily on foreign semiconductor suppliers cannot be ignored, and Upstate New York, which has a robust semiconductor sector, is the perfect place... » read more

Manufacturing Bits: June 23
By Mark LaPedus - 23 Jun, 2020 - Comments: 0

Fan-out gas sensors At the recent IEEE Electronic Components and Technology Conference (ECTC), the University of California at Los Angeles (UCLA) and the Indian Institute of Science presented a paper on the development of a wearable MEMS gas sensor device based on a flexible wafer-level fan-out packaging technology. Researchers have demonstrated a gas sensor device or a personal environment... » read more

Power/Performance Bits: June 23
By Jesse Allen - 23 Jun, 2020 - Comments: 0

Capturing waste heat Researchers at Wuhan University and University of California Los Angeles developed a hydrogel that can both cool down electronics and convert the waste heat into electricity. The thermogalvanic hydrogel consists of a polyacrylamide framework infused with water and specific ions. When they heated the hydrogel, two of the ions (ferricyanide and ferrocyanide) transferred e... » read more

Manufacturing Bits: Nov. 25
By Mark LaPedus - 25 Nov, 2019 - Comments: 0

RF carbon nanotubes For years, the industry has been working on logic and memory devices based on carbon nanotubes, although these technologies remain in R&D. Now, there is a new device type using carbon nanotubes--RF. Startup Carbonics has developed an RF-based carbon nanotube technology that operates at frequencies over 100GHz. The technology exceeds the cutoff frequency of today�... » read more

Manufacturing Bits: Oct. 9
By Mark LaPedus - 09 Oct, 2019 - Comments: 0

World’s strongest silver A group has developed what researchers say is the world’s strongest silver. The silver demonstrated a hardness of 3.05 GPa, which is 42% stronger than the previous world record. The University of Vermont, Lawrence Livermore National Lab, the Ames Laboratory, Los Alamos National Laboratory and UCLA contributed to the work. Silver is an element with high electr... » read more

Power/Performance Bits: Oct. 1
By Jesse Allen - 01 Oct, 2019 - Comments: 0

Nighttime power Researchers at UCLA and Stanford University created a low-cost device that harnesses radiative cooling to provide a small amount of renewable energy at night. While the device only provides a small amount of power, it could be useful for areas without reliable electricity or access to batteries. Radiative cooling happens when a surface that faces the sky emits heat as therma... » read more

The Race To Next-Gen 2.5D/3D Packages
By Mark LaPedus - 23 Sep, 2019 - Comments: 4

Several companies are racing each other to develop a new class of 2.5D and 3D packages based on various next-generation interconnect technologies. Intel, TSMC and others are exploring or developing future packages based on one emerging interconnect scheme, called copper-to-copper hybrid bonding. This technology provides a way to stack advanced dies using copper connections at the chip level,... » read more

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