Meeting Stringent PA_SaveConfigTime In UFS Solution When M-PHY Needs Higher Reconfigure Time

By Synopsys - 31 Jan, 2024 - Comments: 0

The JEDEC Universal Flash Storage (UFS) has emerged as the default mobile storage solution for high-end smartphones and battery-operated devices, owing to its superior speed, performance, and power efficiency. These attributes are essential to meet users' demand for rapid transmission and reception of high-resolution media amid myriad operations. Despite these advantages, UFS's use of the MIPI ... » read more

Week In Review: Design, Low Power

By Jesse Allen - 31 Jan, 2020 - Comments: 0

Flex Logix uncorked a new EFLX 1K eFPGA core optimized for the needs of customers on TSMC 40nm Ultra Low Power (ULP) and 40nm Low Power (LP) process technologies. It targets customers focused on low cost and power management. Using a cut-down version and the same software of the EFLX 4K, the EFLX 1K Logic core has 368 inputs and 368 outputs with 900 LUT4 equivalent logic capacity. The EFLX 1K D... » read more

The Week In Review: Design

By Jesse Allen - 02 Feb, 2018 - Comments: 0

Startups Two new companies unveiled this week – Metrics Technologies and Movellus. Metrics Technologies is providing a Software-as-a-Service SystemVerilog simulator and verification manager that are available as pay-per-minute. This allows companies to have fully elastic system capabilities to accommodate peak simulation demand. “Cloud technology and Software as a Service business mo... » read more

Security For Android-Based Ecosystem With Mobile Storage IP

By Biswanath Tayenjam - 14 Dec, 2017 - Comments: 0

By Biswanath Tayenjam and Licinio Sousa Users are storing more sensitive data in flash memory on their mobile applications such as digital cameras, smart phones and tablets. Because of this reason, the Joint Electron Device Engineering Council (JEDEC) have developed two storage interface standards using inline encryption to secure data: embedded Multimedia Controller (eMMC) and Universal Fla... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 27 Feb, 2015 - Comments: 0

At the SPIE Advanced Lithography conference in San Jose, Calif., there were several takeaways. First, the battle for lithography share is heating up at Intel. “We believe Nikon still holds a decent position at Intel, but with ASML gaining some share at 10nm. Nikon could regain some share with its new platform at 7nm, in our view, but it is early to tell. We believe Nikon has improved its posi... » read more

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tag: UFS

Meeting Stringent PA_SaveConfigTime In UFS Solution When M-PHY Needs Higher Reconfigure Time

Week In Review: Design, Low Power

The Week In Review: Design

Security For Android-Based Ecosystem With Mobile Storage IP

The Week In Review: Manufacturing

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