Bigger, Brighter TVs

By Mark LaPedus - 24 Jul, 2015 - Comments: 0

The flat panel display (FPD) industry is undergoing a renaissance, with suppliers rolling out a dizzying array of new, high-resolution technologies for mobile devices, computers and TVs. But despite being in the eye of the innovation storm, FPD equipment makers remain cautious—and for good reason. There are a slew of new LCD fabs being built today, mostly in China. This, in turn, is promp... » read more

The Week In Review: System-Level Design

By Ed Sperling - 14 Feb, 2014 - Comments: 0

Cadence bought TranSwitch’s high-speed interface IP assets. TranSwitch, which made chips for communications equipment, filed for bankruptcy in November. (The company’s Web site is no longer active.) Cadence also won a deal with Microsoft, which will use Tensilica processors in the new Xbox One audio subsystem. And Cadence rolled out HiFi Audio Tunneling for Android, which takes advantage of... » read more

HDMI 2.0 Specification For 4K TV Unveiled

By Semiconductor Portal - 21 Oct, 2013 - Comments: 0

A new standard for transmitting and receiving 4K video is now public. HDMI 2.0 has a maximum data rate of up to 18Gbps, which is about 76% faster than the previous specification. Steve Venuti, president of HDMI Licensing, introducing the standard. HDMI version 2.0, which was developed by the HDMI Forum, provides a maximum of 4K HD @ 50/60 Hz, 32 audio channels, an audio sampling frequ... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: UHD TV

Bigger, Brighter TVs

The Week In Review: System-Level Design

HDMI 2.0 Specification For 4K TV Unveiled

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