Chip Industry Technical Paper Roundup: Apr. 1


New technical papers recently added to Semiconductor Engineering’s library: [table id=416 /] Find more semiconductor research papers here. » read more

Reverse Engineering NVIDIA GPU Cores (Universitat Politècnica de Catalunya)


A new technical paper titled "Analyzing Modern NVIDIA GPU cores" was published by Universitat Politècnica de Catalunya. Abstract "GPUs are the most popular platform for accelerating HPC workloads, such as artificial intelligence and science simulations. However, most microarchitectural research in academia relies on GPU core pipeline designs based on architectures that are more than 15 yea... » read more

GPU Analysis Identifying Performance Bottlenecks That Cause Throughput Plateaus In Large-Batch Inference


A new technical paper titled "Mind the Memory Gap: Unveiling GPU Bottlenecks in Large-Batch LLM Inference" was published by researchers at Barcelona Supercomputing Center, Universitat Politecnica de Catalunya, and IBM Research. Abstract "Large language models have been widely adopted across different tasks, but their auto-regressive generation nature often leads to inefficient resource util... » read more

Chip Industry Week In Review


The Malaysian government signed a deal with Arm to kickstart a chip design ecosystem. Until now, Malaysia has focused on packaging and test. Adding chip design represents a major change in focus. The country will pay SoftBank $250 million over 10 years for Arm’s chip design IP and train 10,000 engineers. Global chip sales reached $56 billion in January, up nearly 18% from the same period i... » read more

Chip Industry Technical Paper Roundup: Mar. 4


New technical papers recently added to Semiconductor Engineering’s library: [table id=410 /] Find more semiconductor research papers here. » read more

RISC-V High Performance Multicore and GPU SoC Platform For Safety Critical System


A new technical paper titled "A RISC-V Multicore and GPU SoC Platform with a Qualifiable Software Stack for Safety Critical Systems" published by researchers at Universitat Politecnica de Catalunya and Barcelona Supercomputing Center. Abstract "In the context of the Horizon Europe project, METASAT, a hardware platform was developed as a prototype of future space systems. The platform is bas... » read more

Chip Industry Technical Paper Roundup: Feb. 10


New technical papers recently added to Semiconductor Engineering’s library: [table id=405 /] Find all technical papers here. Also find more research and latest news here. » read more

Potential of Wireless Interconnects For Improving Performance And Flexibility Of Multi-Chip AI Accelerators


A new technical paper titled "Exploring the Potential of Wireless-enabled Multi-Chip AI Accelerators" was published by researchers at Universitat Politecnica de Catalunya. Abstract "The insatiable appetite of Artificial Intelligence (AI) workloads for computing power is pushing the industry to develop faster and more efficient accelerators. The rigidity of custom hardware, however, conflict... » read more

Chip Industry Technical Paper Roundup: Nov. 5


New technical papers recently added to Semiconductor Engineering’s library: [table id=378 /]   Further Reading Chip Industry Week In Review Silicon Valley design center and NY EUV Accelerator; Siemens’ big acquisition; Onto extends panel inspection with two acquisitions; DENSO-Quadric deal; thinner Si-based power wafer; $100M funding for AI; trade wars escalate; earnings rep... » read more

Workload-Specific Data Movements Across AI Workloads in Multi-Chiplet AI Accelerators


A new technical paper titled "Communication Characterization of AI Workloads for Large-scale Multi-chiplet Accelerators" was published by researchers at Universitat Politecnica de Catalunya. Abstract "Next-generation artificial intelligence (AI) workloads are posing challenges of scalability and robustness in terms of execution time due to their intrinsic evolving data-intensive characteris... » read more

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