Week In Review: Semiconductor Manufacturing, Test

By Gregory Haley - 18 Aug, 2023 - Comments: 0

Intel dropped out of a $5.4 billion deal to purchase Tower Semiconductor in Israel. Intel cited the inability to obtain regulatory approval in a timely manner as the reason for ending the deal signed in February. Intel will pay a $353 million termination fee to Tower. The silicon wafer supply has moved back into positive territory for 2023 thanks to a 7% decline in wafer shipments combined w... » read more

Week In Review: Design, Low Power

By Susan Rambo - 18 Aug, 2023 - Comments: 0

Synopsys’ board of directors appointed Sassine Ghazi as president and chief executive officer effective on Jan. 1, 2024. Ghazi, who is currently the COO, will succeed Aart de Geus, co-founder, chair, and CEO of Synopsys, who will then become the executive chair of board of directors. IBM Research introduced an energy-efficient mixed-signal analog AI chip for DNN inferencing and demonstra... » read more

Chip Industry Technical Paper Roundup: August 15

By Liz Allan - 15 Aug, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=128 /] More Reading Technical Paper Library home » read more

Chip Industry’s Technical Paper Roundup: August 9

By Liz Allan - 09 Aug, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=124 /] More Reading Technical Paper Library home » read more

New & Faster Single-Crystalline Oxide Thin Films (Max Planck, Cambridge, U of Penn.)

By Technical Paper Link - 07 Aug, 2023 - Comments: 0

A technical paper titled “Li iontronics in single-crystalline T-Nb2O5 thin films with vertical ionic transport channels” was published by researchers at Max Planck Institute of Microstructure Physics, University of Cambridge, University of Pennsylvania, Gumi Electronics and Information Technology Research Institute, Northwestern University, and ALBA Synchrotron Light Source. Abstract: "Th... » read more

Startup Funding: July 2023

By Jesse Allen - 02 Aug, 2023 - Comments: 0

Investors pumped more than $2.8 billion into 123 companies July. It was a particularly strong month for photonics companies, with a photonic integrated circuit foundry raising more than $100 million. Startups this month also are using photonic technology in innovative ways. This includes an all-optical RISC processor, biomarker identification, faster fully homomorphic encryption, and more AI... » read more

CNN Hardware Architecture With Weights Generator Module That Alleviates Impact Of The Memory Wall

By Technical Paper Link - 01 Aug, 2023 - Comments: 0

A technical paper titled “Mitigating Memory Wall Effects in CNN Engines with On-the-Fly Weights Generation” was published by researchers at Samsung AI Center and University of Cambridge. Abstract: "The unprecedented accuracy of convolutional neural networks (CNNs) across a broad range of AI tasks has led to their widespread deployment in mobile and embedded settings. In a pursuit for high... » read more

Week In Review: Auto, Security, Pervasive Computing

By Liz Allan - 28 Jul, 2023 - Comments: 0

BMW, General Motors, Honda, Hyundai, Kia, Mercedes-Benz, and Stellantis will create an electric vehicle charging network, installing more than 30,000 high-powered DC charge points accessible to any cars that use Combined Charging System (CCS) or North American Charging Standard (NACS) connectors. Opening summer 2024, the network will leverage Plug & Charge technology and allow easy digital ... » read more

Chip Industry’s Technical Paper Roundup: July 5

By Liz Allan - 05 Jul, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=114 /] (more…) » read more

Week In Review: Design, Low Power

By Jesse Allen - 30 Jun, 2023 - Comments: 0

Keysight Technologies said it intends to acquire ESI Group for €913 million (~$998.6 million). ESI Group provides virtual prototyping solutions for the automotive and aerospace end markets that can create real-time digital twins to simulate a product's behavior during testing and real-life use. MLCommons announced the latest results from two MLPerf benchmark suites. One aims to measure the... » read more

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tag: University of Cambridge

Week In Review: Semiconductor Manufacturing, Test

Week In Review: Design, Low Power

Chip Industry Technical Paper Roundup: August 15

Chip Industry’s Technical Paper Roundup: August 9

New & Faster Single-Crystalline Oxide Thin Films (Max Planck, Cambridge, U of Penn.)

Startup Funding: July 2023

CNN Hardware Architecture With Weights Generator Module That Alleviates Impact Of The Memory Wall

Week In Review: Auto, Security, Pervasive Computing

Chip Industry’s Technical Paper Roundup: July 5

Week In Review: Design, Low Power

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