Chip Industry Technical Paper Roundup: July 21


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations StreamDQ: Near-Memory Weight DeQuantization in Custom HBM for Scalable AI Inference Acceleration SK hynix Open DRAM Model—Part II: Enabling Processing-in-Memory in 3-D DRAM Georgia Institute of Technology Evaluating Hardware Abstraction Layer Concep... » read more

Monolithic CMOS Platform Integrates Piezo-Optomechanical Photonics (Mitre et al.)


Researchers from MITRE, University of Colorado Boulder, Sandia National Laboratories, University of Arizona, and MIT published a technical paper titled “Monolithic Integration of Piezo-Optomechanical Photonics and CMOS Electronics.” Abstract Excerpt: The paper demonstrates a “fully monolithic, all-CMOS fabricated platform” for piezo-optomechanical photonic integrated circuits and sho... » read more

Research Bits: May 26


Simultaneous energy generation and emission Researchers from the Institute of Science Tokyo and University of Osaka designed an organic semiconductor device that can both generate electricity from light and emit bright visible light. The researchers used two multiple-resonance thermally activated delayed fluorescence (MR-TADF) molecules, v-DABNA and QAO, in a simple layered structure. Their... » read more

Research Bits: Feb. 10


Speeding up 3D NAND etch Researchers from Lam Research, the University of Colorado Boulder, and Princeton Plasma Physics Laboratory (PPPL) investigated ways to speed up the cryogenic reactive ion etching process for 3D NAND by using a combined hydrogen fluoride gas to create the plasma. “Cryo etch with the hydrogen fluoride plasma showed a significant increase in the etching rate compared... » read more

Photonic Compact Chip That Seamlessly Converts Light Into Microwaves (NIST, et al.)


A new technical paper titled "Photonic chip-based low-noise microwave oscillator" was published by researchers at NIST, University of Colorado Boulder, California Institute of Technology, UCSB, University of Virginia and Yale University. Abstract "Numerous modern technologies are reliant on the low-phase noise and exquisite timing stability of microwave signals. Substantial progress has b... » read more

Research Bits: October 31


Skinlike sensor for robots University of British Columbia engineers with help from researchers from Frontier Robotics, Honda research institute, created a soft sensor that approximates skin. Mostly made of silicone rubber, the sensor uses weak electric fields to sense objects, even at a distance, and can detect forces into and along its surface. The sensor could provide touch sensitivity and d... » read more

Week In Review: Design, Low Power


Synopsys’ board of directors appointed Sassine Ghazi as president and chief executive officer effective on Jan. 1, 2024. Ghazi, who is currently the COO, will succeed Aart de Geus, co-founder, chair, and CEO of Synopsys, who will then become the executive chair of board of directors. IBM Research introduced  an energy-efficient mixed-signal analog AI chip for DNN inferencing and demonstra... » read more

Week In Review: Auto, Security, Pervasive Computing


Hyundai, Samsung Catalyst Fund, and others invested a combined $100 million in Canada-based Tenstorrent to accelerate the design and development of AI chiplets and machine-learning software and allow the integration of AI into future Hyundai, Kia, and Genesis vehicles, plus other future mobilities such as robotics and advanced air mobility (AAM). The National Highway Traffic Safety Administr... » read more

Research Bits: June 27


Tunable soliton microcomb Researchers from the University of Rochester and CalTech say they have created the first microwave-rate soliton microcomb that can control the repetition rate at a high speed. Microcombs are frequency combs that can fit on a microchip, which will be useful in photonics. Solitons are solitary waves that keep their shape as they move at a constant speed. The team put an... » read more

Research Bits: June 13


Converting heat to electricity Researchers at the National Institute of Standards and Technology (NIST) and University of Colorado Boulder fabricated a device to boost the conversion of heat into electricity. The technique involves depositing hundreds of thousands of microscopic columns of gallium nitride atop a silicon wafer. Layers of silicon are then removed from the underside of the waf... » read more

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