Manufacturing Bits: Aug. 23

By Ed Sperling - 23 Aug, 2016 - Comments: 0

Rolling Out Solar Power...Literally An International team of researchers have developed solar cells that can be added onto a roll of flexible plastic in liquid form, bringing the same kind of economies of production to the solar industry as rolls of paper and ink did for newspapers more than a century ago. Using a roll-to-roll processing method, the team was able to achieve a power conversi... » read more

Power/Performance Bits: Jan. 19

By Jesse Allen - 19 Jan, 2016 - Comments: 1

Antiferromagnetic memory Physicists at The University of Nottingham, working in collaboration with researchers in the Czech Republic, Germany, Poland, and Hitachi Europe showed that the magnetic spins of antiferromagnets can be controlled to make a completely different form of digital memory. This was the first demonstration of electrical current control of antiferromagnets, and the first... » read more

Power/Performance Bits: Dec. 15

By Jesse Allen - 15 Dec, 2015 - Comments: 0

Biologically powered chip Columbia Engineering researchers powered an integrated circuit from adenosine triphosphate (ATP), the energy currency of life. They achieved this by integrating a conventional solid-state CMOS integrated circuit with an artificial lipid bilayer membrane containing ATP-powered ion pumps, opening the door to creating entirely new artificial systems that contain both b... » read more

System Bits: Feb. 3

By Ann Mutschler - 03 Feb, 2015 - Comments: 0

A viable silicon substitute A new study by UC Berkeley, the University of Pennsylvania and the University of Illinois at Urbana-Champaign (UIUC) moves graphene a step closer to knocking silicon off as the dominant workhorse of the electronics industry. They reminded that while silicon is ubiquitous in semiconductors and integrated circuits, researchers have been eyeing graphene, a one-atom... » read more

Amazing New Materials

By Michael Watts - 20 Mar, 2014 - Comments: 0

Materials are fundamental to active photonics devices, and there were plenty of developments discussed at Photonics West 2014. Element Six was happy to talk about progress in making large single-crystal diamond and even larger polycrystalline diamond wafers. Carbon has a number of stable forms; diamond, graphite, nanotubes and amorphous carbon. The Element Six process uses CVD conditions in ... » read more

System Bits: Sept. 24

By Ann Mutschler - 24 Sep, 2013 - Comments: 0

Printing nanostructures with self-assembling material A multi-institutional team of engineers from the University of Illinois at Urbana-Champaign, the University of Chicago and Hanyang University in Korea has developed a new approach to the fabrication of nanostructures for the semiconductor and magnetic storage industries. The approach combines top-down advanced ink-jet printing technology... » read more

Dangerous Electricity

By Ann Mutschler - 11 Apr, 2013 - Comments: 0

Electricity to the modern age is as indispensible as air, but too much can be a bad thing for automotive and aerospace applications—especially when it is in the form of electrostatic discharge (ESD). As chips advance to 28nm, 20nm and 16nm, the design window for electrostatic discharge is shrinking for a number of reasons, explained Norman Chang is vice president and senior product strategis... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer