System Bits: Dec. 15

By Ann Mutschler - 15 Dec, 2015 - Comments: 0

Building chips skyscraper style With the aim of boosting electronic performance by factor of a thousand, a team of researchers led by Stanford University engineers have created a skyscraper-like chip design, based on materials more advanced than silicon. For many years, computer systems have been designed with processors and memory chips laid out like single-story structures in a suburb whe... » read more

System Bits: Sept. 15

By Ann Mutschler - 15 Sep, 2015 - Comments: 0

Cache-coherence innovation for thousand-core chips MIT researchers are getting ready to unveil what they say is the first fundamentally new approach to cache coherence in more than three decades. They reminded that in a modern, multicore chip, every processor core has its own small memory cache, where it stores frequently used data. The chip also has a larger, shared cache, which all the cores... » read more

One-on-One: Smarter Architectures

By Ed Sperling - 02 Apr, 2015 - Comments: 0

Edward Lee, distinguished professor of electrical engineering and computer science professor at the [getentity id="22165" comment="UC Berkeley"], sat down with Semiconductor Engineering to talk about what is needed to maximize the usefulness of the [getkc id="76" comment="Internet of Things"] and how our perceptions need to shift to take advantage of this technology. What follows are excerpts o... » read more

System Bits: Feb. 24

By Ann Mutschler - 24 Feb, 2015 - Comments: 0

New solder for semis A research team led by the University of Chicago has demonstrated how semiconductors can be soldered and still deliver good electronic performance by working out new chemistry for a broad class of compositions relevant to semiconductors. The compounds that the team developed can be used to join pieces of semiconductor, which researchers have longed struggled with. Th... » read more

Power/Performance Bits: Feb. 3

By Jesse Allen - 03 Feb, 2015 - Comments: 0

Bulletproof vests for batteries It was almost two years ago that the Boeing Dreamliner was grounded because of fires caused by its lithium-ion batteries. Now researchers at the University of Michigan have used nanofibers extracted from Kevlar, best known as the material in bulletproof vests, to create a new barrier between the electrodes in a lithium-ion battery. Lithium atoms in batterie... » read more

System Bits: Dec. 8

By Ann Mutschler - 08 Dec, 2014 - Comments: 0

Path to quantum transistors An odd, iridescent material that's puzzled physicists for decades turns out to be an exotic state of matter that could open a new path to quantum computers and other next-generation electronics, according to University of Michigan physicists. The researchers have been able to confirm that several properties of the compound samarium hexaboride that raise hopes for... » read more

Smartphones Show Their Weaknesses

By Ann Mutschler - 04 Sep, 2014 - Comments: 0

According to researchers at the University of Michigan, a weakness believed to exist in Android, Windows and iOS operating systems could be used to obtain personal information from unsuspecting users. This hack was demonstrated in an Android phone and was successful between 82 and 92% of the time on six of seven popular apps that were tested. Gmail, CHASE Bank and H&R Block were among those ... » read more

System Bits: Aug. 12

By Ann Mutschler - 12 Aug, 2014 - Comments: 0

Wearable, continuous disease monitoring A new wearable vapor sensor being developed at the University of Michigan could one day offer continuous disease monitoring for patients with diabetes, high blood pressure, anemia or lung disease, according to researchers there. The new sensor, which can detect airborne chemicals either exhaled or released through the skin, would likely be the first w... » read more

System Bits: May 27

By Ann Mutschler - 27 May, 2014 - Comments: 0

Making sheets of grapheme more easily Graphene’s promise as a material for new kinds of electronic devices, among other uses, has led researchers around the world to study the material in search of new applications but one of the biggest limitations to wider use of the strong, lightweight, highly conductive material has been the hurdle of fabrication on an industrial scale. Initial work w... » read more

Power/Performance Bits: March 11

By Ann Mutschler - 11 Mar, 2014 - Comments: 0

Multiferroic materials In an advance aimed at making future electronic devices far more energy-efficient than current technologies, researchers from the UCLA Henry Samueli School of Engineering and Applied Science have made major improvements in computer processing using an emerging class of magnetic materials called multiferroics. The team used multiferroic magnetic materials to reduce the... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

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Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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