Week In Review: Semiconductor Manufacturing, Test

By Karen Heyman - 20 Jan, 2023 - Comments: 0

Dutch tech industry group FME called for the European Commission to draft a position on whether and how to restrict computer chip technology exports to China, saying "more unified and powerful action" was needed from Europe, according to Reuters. Meanwhile, Dutch Prime Minister Mark Rutte said he saw gradual progress in talks with the U.S. over potential new restrictions on exporting chip-makin... » read more

Manufacturing Bits: April 3

By Mark LaPedus - 03 Apr, 2018 - Comments: 0

World's brightest accelerator Japan’s High Energy Accelerator Research Organization (KEK) is readying what is considered the world’s most luminous or brightest particle accelerator. The system, dubbed the SuperKEKB, combines an electron-positron collider with a new and advanced detector. The storage ring system is designed to explore and measure rare decays of elementary particles, such... » read more

Power/Performance Bits: Dec. 23

By Ann Mutschler - 23 Dec, 2014 - Comments: 0

Glimpsing pathway of sunlight to electricity According to University of Oregon and Lund University researchers, four pulses of laser light on nanoparticle photocells in a University of Oregon spectroscopy experiment have opened a window on how captured sunlight can be converted into electricity. The work, which the researchers expect could inspire devices with improved efficiency in solar e... » read more

Power/Performance Bits: Nov. 25

By Ann Mutschler - 25 Nov, 2014 - Comments: 0

Better photodetectors Photodetectors are semiconductor devices that convert incoming light into electrical signals used in a vast array of products, from visible and infrared light detection systems to television remote controls. Meanwhile, perovskite is an organic-inorganic hybrid material with a crystal structure that is very efficient at converting light into electricity, and in recent year... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: University of Oregon

Week In Review: Semiconductor Manufacturing, Test

Manufacturing Bits: April 3

Power/Performance Bits: Dec. 23

Power/Performance Bits: Nov. 25